Etching profile prediction system was developed by combination of an on-wafer sensor and simulation. We have developed on-wafer UV sensor, on-wafer charge-up sensor, and onwafer sheath shape sensor. These sensors can measure plasma process conditions on the sample stage such as UV irradiation, charge-up voltage in high aspect ratio structures, and ion sheath condition at the plasma/surface interface. Then the output of the sensors can be used for computer simulation. The system can predict etching profile anomaly around large scale 3D structure which causes distortion of ion sheath and ion trajectory. Also, it can predict etching profile anomaly caused by the charge accumulation in high-aspect ratio holes. Also, distribution of UV-radiation damage in materials can be predicted.