1999
DOI: 10.1109/2944.788433
|View full text |Cite
|
Sign up to set email alerts
|

Ion-implanted GaAs-InGaAs lateral current injection laser

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1

Citation Types

0
6
0

Year Published

2001
2001
2016
2016

Publication Types

Select...
5
2
2

Relationship

0
9

Authors

Journals

citations
Cited by 15 publications
(6 citation statements)
references
References 24 publications
0
6
0
Order By: Relevance
“…Previous studies of edge-emitting lateral current injection lasers found that the performance was worse than in comparable vertical injection lasers due to a nonuniform carrier distribution in the active region. 12,13 This is because the lasers were fabricated with intrinsic regions wider than the ambipolar diffusion length, which in most III-V materials is approximately 1 m. Improvements in fabrication techniques should allow the intrinsic region width to be reduced significantly, leading to better performance.…”
mentioning
confidence: 99%
See 1 more Smart Citation
“…Previous studies of edge-emitting lateral current injection lasers found that the performance was worse than in comparable vertical injection lasers due to a nonuniform carrier distribution in the active region. 12,13 This is because the lasers were fabricated with intrinsic regions wider than the ambipolar diffusion length, which in most III-V materials is approximately 1 m. Improvements in fabrication techniques should allow the intrinsic region width to be reduced significantly, leading to better performance.…”
mentioning
confidence: 99%
“…Ion implantation induced damage introduces nonradiative recombination centers, and the PL intensity was observed to decrease significantly in the implanted regions, similar to what has been observed in other experiments. 12,13 The unimplanted regions are left undamaged, so the emission intensity there is unaffected.…”
mentioning
confidence: 99%
“…The InP bulk wafer with AlGaInAs MQWs and InGaAs SCH layer is first patterned and etched approximately 300 nm to form alignment marking pattern on the top surface of the III/V wafer. The Si, P and Be implantation is done subsequently to form the N+ region and P+ region, which has been widely adapted for the LCI laser device fabrication as described Ref [12]. The next step is to join the III/V and silicon material together by direct wafer bonding, which is a wellestablished technique to achieve atomic level bonding with minimized interfacial dislocations.…”
Section: Fabrication Discussionmentioning
confidence: 99%
“…However, this technique is very complicated and requires additional electron-beam lithography steps [29]. Alternatively, ion implantation has been explored as a method to form LCI edge-emitting GaAs lasers and more recently electroluminescent devices in InGaAsP PC membranes [30], [31]. We build off of these works and refine a technique to form a lateral junction in GaAs with high precision and reproducibility.…”
Section: Fabrication and Designmentioning
confidence: 99%