Ion implantation as a pre-treatment method of AlN substrate for direct bonding with copper

Barlak, M.; Olesińska, W.; Piekoşzewski, J.; Chmielewski, Marcin; Jagielski, J.; Kaliński, D.; Werner, Z.; Sartowska, B.

doi:10.1016/j.vacuum.2005.01.027

Cited by 15 publications

(9 citation statements)

References 3 publications

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“…When using ceramic materials in advanced industrial products it is often required that a metal/ceramic joint should be formed or the surface of the ceramic should be modified [1][2][3][4][5][6][7] so as to combine the properties, intrinsically different, of the ceramic and the metal and to obtain a product with the desired properties and functions. The ceramic/metal joints have been made by two methods.…”

Section: Introductionmentioning

confidence: 99%

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Utilizing the energy of kinetic friction for the metallization of ceramics

Chmielewski

Golański

Włosiński

et al. 2015

Bulletin of the Polish Academy of Sciences Technical Sciences

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Abstract. The paper is concerned with the metallization of ceramic materials using the friction-welding method in which the mechanism of the formation of a joint involves the kinetic energy of friction. The friction energy is directly transformed into heat and delivered in a specified amount precisely to the joint being formed between the metallic layer and the substrate material. The paper describes the ceramic metallization process, which has been developed by the present authors based on the friction-welding method.The stress and temperature fields induced in the joint during the metallization process were determined using the finite element method with the aim to optimize the process parameters. The results were verified experimentally. The structures of the metallic coatings thus obtained were examined and the results are discussed in the paper.

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Section: Introductionmentioning

confidence: 99%

“…The methods most frequently used in the industrial practice are powder metallurgy, active brazing, PVD, CVD and IPD [17,21,22]. Another known method consists of the activation of the ceramic surface by metal ion implantation [1,7,14,20,23].…”

Section: Introductionmentioning

confidence: 99%

Utilizing the energy of kinetic friction for the metallization of ceramics

Chmielewski

Golański

Włosiński

et al. 2015

Bulletin of the Polish Academy of Sciences Technical Sciences

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“…Keller et al [14] and Eustahopoulus [11] identified the M 6 O phases (Ti 3 Cu 3 O and Ti 4 Cu 2 O) on the surface of alumina, whereas Olesińska et al [15] report on the presence of the M 6 C phase on the SiC substrate after joining. In both oxide-and non-oxide ceramic materials, the surface processes are extremely important since these materials are not wetted by molten metal's, whereas the formation of new phases during joining with the participation of active oxygen or titanium always proceeds with the interference into the structure of the near-surface layer of the substrate [17][18][19].…”

Section: Introductionmentioning

confidence: 99%

The relationship between microstructure and mechanical properties of directly bonded copper-alumina ceramics joints

Pietrzak¹,

Olesińska²,

Kaliński³

et al. 2014

Bulletin of the Polish Academy of Sciences: Technical Sciences

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The effect of phase transformations induced in the surface layer of alumina ceramics during its direct joining with copper activated with oxygen or titanium on the mechanical strength of the ceramic/copper joints was examined. The materials used in the experiments were an alumina single crystal, alumina ceramics (97.5 wt% Al2O3), the cermet mixtures: Cu-Cu2O with 10-50 wt% of Cu2O, copper with 5 wt% of Ti, and copper with 5 wt% of Ti and 10 wt% of Ag. The microstructure of the transition layer was examined by the X-ray diffraction method (XRD), scanning electron microscopy method (SEM) and energy dispersive x-ray spectroscopy (EDX). The mechanical strength of the joints was measured using the three-point bending method. The amount of oxygen optimal for the joining process was determined. It has been demonstrated that the cohesion of the joints depends not only on the formation of the individual phases but also, or even primarily, on the microstructure of the transition layer formed between them.

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“…With regard to the fabrication of Cu-AlN composites there are not too many works reported in the literature [8,9]. The authors of [8] employed a hot pressing method to obtain Cu-AlN composite materials at 1050 • C. They used presintered AlN-Y 2 O 3 grains (75-150 µm) after the pulverization process.…”

Section: Introductionmentioning

confidence: 99%

“…The authors of [8] employed a hot pressing method to obtain Cu-AlN composite materials at 1050 • C. They used presintered AlN-Y 2 O 3 grains (75-150 µm) after the pulverization process. Using higher temperatures is limited by the melting point of copper (1083 • C) and lack of wettabillity of aluminium nitride by liquid copper [9]. This disadvantage can be changed by modifying of ceramic substrate by different techniques like: ion implantation or ion beam treatment [10][11][12][13].…”

Section: Introductionmentioning

confidence: 99%

Comparison of experimental and modelling results of thermal properties in Cu-AlN composite materials

Chmielewski

Węglewski

2013

Bulletin of the Polish Academy of Sciences: Technical Sciences

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Copper-based composites could be widely used in automotive, electronic or electrical industry due to their very promising thermal properties. In the present paper, Cu-AlN metal matrix composites with ceramic volume fractions between 0.1 and 0.4 were fabricated by hot pressing method in vacuum. Dependence of the coefficient of thermal expansion (CTE) and the thermal conductivity (TC) on the chemical composition of composites has been investigated. The measured values of the thermal expansion coefficient have been compared with the analytical models’ predictions. A numerical model based on FEAP 7.5 in 3D space has been used to evaluate the influence of the porosity on the thermal properties (thermal conductivity) of the composite. A fairly good correlation between the FEM results and the experimental measurements has been obtained.

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Ion implantation as a pre-treatment method of AlN substrate for direct bonding with copper

Cited by 15 publications

References 3 publications

Utilizing the energy of kinetic friction for the metallization of ceramics

Utilizing the energy of kinetic friction for the metallization of ceramics

The relationship between microstructure and mechanical properties of directly bonded copper-alumina ceramics joints

Comparison of experimental and modelling results of thermal properties in Cu-AlN composite materials

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