Development and instrumentation of an integrated three-dimensional optical testing system for application in integrated circuit packaging Rev. Sci. Instrum. 76, 093109 (2005); 10.1063/1.2042647 Fabrication of three-dimensional microstructures by two-dimensional slice by slice approaching via focused ion beam milling Use of the focused ion beam to locate failure sites within electrically erasable read only memory microcircuits J. Vac. Sci. Technol. A 22, 902 (2004); 10.1116/1.1651542Reconstruction of three-dimensional chemistry and geometry using focused ion beam microscopyWe constructed an ion and electron dual focused beam apparatus to develop a novel three-dimensional ͑3D͒ microanalysis technique. In this method, a Ga focused ion beam ͑Ga FIB͒ is used as a tool for successive cross sectioning of the sample in the ''shave-off'' mode, while an electron beam ͑EB͒ is used as a primary probe for Auger mapping of the cross sections. Application of postionization with EB to Ga-FIB secondary ion mass and two-dimensional ͑2D͒ elemental mapping with Ga-FIB-induced Auger electrons are also in the scope of the apparatus. The 3D microanalysis was applied to a bonding wire on an integrated circuit ͑IC͒. A series of EB-induced sample current images of the successive cross sections were obtained as a function of the cross-sectioning position. This result showed the capability to realize the 3D Auger microanalysis. Two-dimensional elemental mapping with Ga-FIB-induced Auger electrons was realized for the first time on the IC surface. Its applicability to surface analysis was evaluated.