1979
DOI: 10.1063/1.326355
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Ion- and electron-assisted gas-surface chemistry—An important effect in plasma etching

Abstract: The extent to which gas-surface chemical reactions can be enhanced by energetic radiation (primarily ions and electrons) incident on the surface is described. Emphasis is placed on chemical systems which lead to volatile reaction products. In particular, the reactions of Si, Si0 2 , and Si3N4 with XeF 2 , F 2 , and Cl 2 are examined experimentally. Possible mechanisms for the radiation-induced enhancement are discussed and some technological implications of this process in plasma etching technology and lithogr… Show more

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Cited by 704 publications
(254 citation statements)
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“…Such synergistic interactions are also known from other systems such as silicon etching in fluorine-containing plasmas [21] or the etching of a-C:H by thermal atomic hydrogen plus noble gas ion bombardment [22,23]. Landkammer et al [24] * Corresponding author, e-mail: Christian.Hopf@ipp.mpg.de and Jacob et al [7] have investigated the erosion of a-C:H in oxygen electron-cyclotron-resonance plasmas.…”
mentioning
confidence: 99%
“…Such synergistic interactions are also known from other systems such as silicon etching in fluorine-containing plasmas [21] or the etching of a-C:H by thermal atomic hydrogen plus noble gas ion bombardment [22,23]. Landkammer et al [24] * Corresponding author, e-mail: Christian.Hopf@ipp.mpg.de and Jacob et al [7] have investigated the erosion of a-C:H in oxygen electron-cyclotron-resonance plasmas.…”
mentioning
confidence: 99%
“…All sources are positioned on a linear shift such that the source-substrate distance can be varied. The gases H 2 , D 2 , SiH 4 , SiD 4 , Si 2 H 6 , and Ar can be introduced into the sources or chamber after passing a gas purifier.…”
Section: Methodsmentioning
confidence: 99%
“…The a-Si:H films have been deposited by the hot wire source from pure SiH 4 and at a substrate temperature of 250 ºC. The filament current has been set at 11 A (filament temperature is 2325±200 K), the SiH 4 flow at 3 sccm, and the pressure in the deposition chamber has been controlled at 8 mTorr.…”
Section: Depositionmentioning
confidence: 99%
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“…[13][14][15] A manipulator provided XYZ rotation and angle tilt ability to the sample holder. With further modification, it could provide temperature control for TPD (temperature programmed desorption) research.…”
Section: Methodsmentioning
confidence: 99%