(Invited) Plasma Processes for Emerging Silicon-Based MEMS, NEMS and Packaging Applications

Abstract

Plasma processes are important for emerging silicon-based microelectro-mechanical systems (MEMS), nano-electro-mechanical systems (NEMS) and packaging applications. Typically every device has a customised process flow but synergies can be found as most are produced using a 2.5D approach comprising sequential deposition, lithography and etch cycles. Plasma processes are critical in enabling reproducible dry deposition and etch steps during manufacturing. Increasingly plasma processes are also being adopted in nano-imprint lithography and bonding process steps. The merits of each plasma technique and their application to emerging devices are discussed -including silicon etch that is at the heart of most MEMS and NEMS devices. Increasingly, large cavities are also being etched to realise multi-wafer devices where through silicon vias (TSVs) are emerging as a key interconnect technology. The integration of ALD into MEMS is becoming more common whilst NEMS devices are taking advantage novel combinations of plasma processes and materials to realise new functions.

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“…The long needles were formed in an Oxford Instruments System 100 fitted with a Cobra300 ICP source. A cryogenic etch 47,48,[56][57][58] was used as follows: SF 6 (60 sccm), O 2 (10 sccm), 10 mTorr pressure, 800 W ICP power, 6 W RIE power, À110 1C electrode, with 10 Torr He applied to the backside of the wafer for effective cooling, 30 min etching time. These long needles are some of the longest bSi features reported to date.…”