Investigations on the thermal behavior of interconnects under ESD transients using a simplified thermal RC network

Salome, P.; Leroux, C.; Crevel, P.; Chante, Jean-Pierre

doi:10.1016/s0026-2714(99)00073-6

Cited by 11 publications

(5 citation statements)

References 8 publications

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“…The method of spatial equivalent circuit modeling proposed in this study is derived from the finite difference method, in which the differential equations for an elemental volume of a three-dimensional grid are expressed in the form of equivalent electrical circuits. A similar technique is often used to solve thermal conductivity problems [21,24,25]. The well-known equivalent circuit widely used to solve thermal conductivity problems is expanded in this study.…”

Section: Validation Of the Methods And Comparison With A Proved Methodologymentioning

confidence: 99%

“…In this article, we will first use the equivalent circuit developed in [24], then expand it to include an electrical domain for mutual simulation of thermal and electrical processes, and finally add thermoelectric process to the expanded circuit. The thermoelectric analogies used in [19,21,24,25] are listed in Table 1.…”

Section: Electrical Analogymentioning

confidence: 99%

“…For the sake of reconstructing the equivalent circuit provided in [24], let us rewrite Equation (3) using the relations listed in Table 1.…”

Section: Thermal Domainmentioning

confidence: 99%

“…This technique allows the performance of joint simulations of thermoelectric devices together with external thermal and electrical elements, such as heat sources, heatsinks, and electronic converters and loads using electrical circuits simulation software. Equivalent R-C circuits have been used before for simplified simulations of thermal and electrical processes [24]. In some records on heat and mass transfer, methods of thermoelectric analogies are proposed for the analysis of both static and dynamic processes [25].…”

Section: Introductionmentioning

confidence: 99%

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Spatial Equivalent Circuit Model for Simulation of On-Chip Thermoelectric Harvesters

2020

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Interest in autonomous low-power energy sources has risen with the development and widespread use of devices with very low energy consumption. Interest in thermoelectric harvesters has increased against this background. Thermoelectric harvesters, especially harvesters on-chip, have peculiar properties related to the thermal route, thermal transients, and spatial temperature distribution within the chip. A behavioral model of the harvester is required for engineers to successfully develop voltage converters with maximum power point tracking and energy storage units. There are accurate models based on the finite element method, but these models are usually not compatible with simulators of electrical circuits, and therefore are not convenient for designers. Existing equivalent circuit models fit this requirement, but usually do not consider many parameters. This article proposes an original method that allows simulating spatial thermoelectric processes by analogy with the finite difference method, using electrical circuits simulations software. The study proposes a complete methodology for building the model and examples of simulations of one-, two- and three-dimensional problems, as well as examples of simulation of macro problems in the presence of external thermal and electrical devices, such as heatsink and electrical load.

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Section: Validation Of the Methods And Comparison With A Proved Methodologymentioning

confidence: 99%

Section: Electrical Analogymentioning

confidence: 99%

“…For the sake of reconstructing the equivalent circuit provided in [24], let us rewrite Equation (3) using the relations listed in Table 1.…”

Section: Thermal Domainmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Spatial Equivalent Circuit Model for Simulation of On-Chip Thermoelectric Harvesters

2020

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“…On the other hand, Figure 7b, shows the thermal circuit of one volume element where C T is the thermal capacitance representing the storage energy rate in a small volume of solid [32]. The conduction heat transfer resistance is modelled with the six thermal resistances oriented from the center of the volume element [33,34]. The other two resistors are used to model the convective heat flow between the metal surface and the environment.…”

Section: Thermal Distributed Element Circuitmentioning

confidence: 99%

Digital Twin-Enabled Modelling of a Multivariable Temperature Uniformity Control System

Araque,

Angel,

Viola

et al. 2024

Electronics

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The use of a digital twin as an enabling technology for industry 4.0 provides control systems engineers with novel tools for modelling, designing, and controlling complex systems, providing a deep understanding of the physical asset based not only on its physics but also the real system’s response. It is particularly critical for uniformity temperature control applications, where providing a reasonable model of the system’s diffusion is always affected by the physical behavior of the system’s components required for heating, cooling, or power distribution. In this paper, a digital twin is used to represent a multivariable thermoelectric system employed for temperature uniformity distribution control with potential applications in semiconductor manufacturing. The modelling employs a five-step methodological framework consisting of the stages: target system definition, system description, multiphysics and data-driven simulation, behavioral matching, and implementation to represent the system’s temperature distribution accurately. The temperature distribution is measured using an infrared thermal camera to perform model behavioral matching on heating and cooling temperature uniformity applications. The obtained results indicated that using digital twins not only increases the accuracy of the system’s representation but can also provide the system with novel information that can be leveraged for the design and implementation of smart control systems.

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1D analog behavioral SPICE model for hot wire sensors in the continuum regime

Heyd

Hadaoui

Saboungi

2012

Sensors and Actuators A: Physical

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Investigations on the thermal behavior of interconnects under ESD transients using a simplified thermal RC network

Cited by 11 publications

References 8 publications

Spatial Equivalent Circuit Model for Simulation of On-Chip Thermoelectric Harvesters

Spatial Equivalent Circuit Model for Simulation of On-Chip Thermoelectric Harvesters

Digital Twin-Enabled Modelling of a Multivariable Temperature Uniformity Control System

1D analog behavioral SPICE model for hot wire sensors in the continuum regime

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