2009 3rd International Conference on Signals, Circuits and Systems (SCS) 2009
DOI: 10.1109/icscs.2009.5412624
|View full text |Cite
|
Sign up to set email alerts
|

Investigations on electrical-only test setup for MEMS convective accelerometer

Abstract: In this paper, we investigate potential solutions for the development of an electrical-only test procedure for MEMS convective accelerometers. The objective is to define an alternative low-cost test procedure applicable at wafer-level. Simple electrical test measurements are analyzed and a behavioral model allowing fault injection is developed. Simulation results show that most of the parametric faults that affect the device specifications can be detected with electrical measurements. Only faults that affect t… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3

Citation Types

0
3
0

Year Published

2010
2010
2021
2021

Publication Types

Select...
5
1
1

Relationship

2
5

Authors

Journals

citations
Cited by 8 publications
(3 citation statements)
references
References 12 publications
0
3
0
Order By: Relevance
“…More accurate behavioral models were established for guiding and evaluating subsequent design [ 22 , 25 , 26 , 27 , 28 , 41 , 49 , 54 , 55 , 56 ]. The establishment of the Hardware Description Language (HDL) model of the accelerometer made it possible to design the sensor and Application Specific Integrated Circuit (ASIC) simultaneously at the system level [ 56 , 57 ]. Moreover, test and calibration strategies for manufacturing micromachined thermal accelerometers with a fully electrical setup were proposed and optimized, and many electrical test methods and alternative test methods based on the high-level behavioral model and fault model were proposed as well.…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…More accurate behavioral models were established for guiding and evaluating subsequent design [ 22 , 25 , 26 , 27 , 28 , 41 , 49 , 54 , 55 , 56 ]. The establishment of the Hardware Description Language (HDL) model of the accelerometer made it possible to design the sensor and Application Specific Integrated Circuit (ASIC) simultaneously at the system level [ 56 , 57 ]. Moreover, test and calibration strategies for manufacturing micromachined thermal accelerometers with a fully electrical setup were proposed and optimized, and many electrical test methods and alternative test methods based on the high-level behavioral model and fault model were proposed as well.…”
Section: Introductionmentioning
confidence: 99%
“…Moreover, test and calibration strategies for manufacturing micromachined thermal accelerometers with a fully electrical setup were proposed and optimized, and many electrical test methods and alternative test methods based on the high-level behavioral model and fault model were proposed as well. Other studies focused on decreasing the time cost in product screening and increasing production yield for batch production of accelerometers, which is very helpful to decrease the final cost of the products and make them more competitive in the market [ 57 , 58 , 59 , 60 , 61 , 62 ]. Applications of thermal accelerometers have been also investigated, such as convection sensors used for tilt measurement [ 6 ].…”
Section: Introductionmentioning
confidence: 99%
“…In our case, convective accelerometers already demonstrated their reliability so it is not necessary to work on their design to improve reliability. In some previous studies, we proposed techniques for test and calibration of such accelerometers using electrical-only stimuli [4][5][6]. This point is really important as the cost of these test procedures may drastically impact the final cost in the case of low-end products such as those used for consumer applications.…”
Section: Introductionmentioning
confidence: 99%