2002
DOI: 10.1016/s0167-9317(02)00547-6
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Investigations of the development rate of irradiated PMMA microstructures in deep X-ray lithography

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Cited by 32 publications
(15 citation statements)
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“…It has been shown by several authors (Mappes et al 2006;Meyer et al 2002b;Meyer et al 1999) that the rate of development for PMMA is:…”
Section: Resist Developmentmentioning
confidence: 99%
“…It has been shown by several authors (Mappes et al 2006;Meyer et al 2002b;Meyer et al 1999) that the rate of development for PMMA is:…”
Section: Resist Developmentmentioning
confidence: 99%
“…Important parameters are stress levels or annealing behavior for applications where heat or higher temperatures are involved. The applied electroplating procedures used in the LIGA process chain are gold plating for X-ray mask fabrication and nickel plating for molding tools [13] and metallic micro components. Further alloys may be deposited in resist molds such as, Ni-Co or Ni-Fe.…”
Section: Micro-electroplating Technologymentioning
confidence: 99%
“…The development process [8] used for the PMMA positive resist uses the GG developer, a first rinse in BDG and lastly the substrate is rinsed in DI water and dried. Developing time depends systematically on the resist system, resist thickness, exposure parameters and developer temperature.…”
Section: Exposure and Developmentmentioning
confidence: 99%