Investigations of interfacial reactions of Sn–Zn based and Sn–Ag–Cu lead-free solder alloys as replacement for Sn–Pb solder

Islam, M. N.; Chan, Y.C.; Rizvi, M.J.; Jillek, W.

doi:10.1016/j.jallcom.2005.03.053

Cited by 133 publications

(61 citation statements)

References 18 publications

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“…Different from the reference Sn-40Bi-0.1Cu solder alloy, Cu 6 Sn 5 precipitates were not found in the Sn-40Bi-2Zn-0.1Cu solder because Cu reacts more strongly with Zn than Sn does; thus, all of the Cu was consumed in the formation of Cu-Zn IMCs [17]. These results were also very similar to the studies of Islam and Li [22,23]. According to the X-ray diffraction (XRD) and energy dispersive spectroscopy (EDS) analysis, globular CuZn 2 and blocky Cu 5 Zn 8 precipitates were formed in Sn-40Bi-2Zn-0.1Cu solder; in particular, Zn atoms segregated between the Sn-and Bi-rich matrices and reacted with Cu atoms to form Cu-Zn IMC particles [17].…”

Section: Recent Progress In Soldering Materialssupporting

confidence: 84%

Low Melting Temperature Solder Materials for Use in Flexible Microelectronic Packaging Applications

Kim¹,

Yang²

2017

Recent Progress in Soldering Materials

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The increasing application of heat-sensitive microelectronic components such as a multitude of transistors, polymer-based microchips, and so on, and flexible polymer substrates including polyethylene terephthalate (PET) and polyimide (PI), among others, for use in wearable devices has led to the development of more advanced, low melting temperature solders (<150°C) for interconnecting components in various applications. However, the current low melting temperature solders face several key challenges, which include more intermetallic compound formation (thus become more brittle), cost issues according to the addition of supplementary elements to decrease the melting point temperature, an increase in the possibility of thermal or popcorn cracking (reliability problems), and so on. Furthermore, the low melting temperature solders are still required to possess rapid electronic/electrical transport ability (high electrical conductivity and current density) and accompany strong mechanical strength sustaining the heavy-uploaded microelectronic devices on the plastic substrates, which are at least those of the conventional melting temperature solders (180-230°C). Thus, the pursuit of more advanced low melting temperature solders for interconnections is timely. This review is devoted to the research on three methods to improve the current properties (i.e., electrical and thermomechanical properties) of low melting temperature solders: (i) doping with a small amount of certain additives, (ii) alloying with a large amount of certain additives, and (iii) reinforcing with metal, carbon, or ceramic materials. In this review, we also summarize the overall recent progress in low melting temperature solders and present a critical overview of the basis of microscopic analysis with regard to grain size and solid solutions, electrical conductivity by supplementation with conductive additives, thermal behavior (melting point and melting range) according to surface oxidation and intermetallic compound formation, and various mechanical properties.

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Section: Recent Progress In Soldering Materialssupporting

confidence: 84%

Low Melting Temperature Solder Materials for Use in Flexible Microelectronic Packaging Applications

Kim¹,

Yang²

2017

Recent Progress in Soldering Materials

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“…Instead, Pb-free solders such as Sn-Ag-Cu or Sn-Cu solder systems have been widely studied as alternative electronics packaging materials [3][4][5][6][7][8][9]. The Sn-3.5Ag-0.5Cu composition, which is often used in current industrial processes, has a melting point of 217 ℃.…”

Section: Introductionmentioning

confidence: 99%

Liquid-Phase Reaction Sintering Behavior at below 200 °C and Electrical Sheet Resistance of Sn-58Bi/Cu Composite Pastes

Hwang¹,

Jeong²,

Lee³

2018

Korean J. Met. Mater.

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We used Sn-58Bi and Cu wires to investigate the effects of variable conditions (such as pressure and wire diameter) on the formation of three-component nanoparticles. In the synthesis of the three-component nanoparticles, pulsed wire discharge was used to sublimate the wires. In this system, the K factor is described as Ec/Es, where Ec and Es are respectively the applied energy and the sublimation energy of the system. Experiments were conducted in a N2 atmosphere using the following parameters: voltage of 6 kV, pressure of 50-100 kPa, and Cu wire diameters of 0.1 and 0.2 mm. X-ray diffraction and field emission scanning electron microscopy were employed for structural analysis, particle size distribution analysis, collection rate, and composition studies of the nanoparticles.†

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“…The importance of soldering is increasing due to the rapid growth of electronic packaging industries [1][2][3]. Lead-containing solders (Sn-Pb) have been widely used as low temperature joining alloys because of their good combination of process attributes, convenient material properties, and low cost [4,5].…”

Section: Introductionmentioning

confidence: 99%

Enhancement of the Surface Smoothness of Cu Ribbon for Solar Cell Modules

Cho¹,

Cho²

2015

Transactions on Electrical and Electronic Materials

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We studied the relationship between the surface smoothness of the internal Cu ribbon and the morphology of the Sn-Pb plating layer for solar cell modules. A bumpy surface was observed on the surface of the solar ribbon, which caused irregular reflection of light. Large, Pb-rich, primary α-phases were found below the convex surface of the solar ribbon, passing from the surface of the internal Cu ribbon to the surface of the plating layer. The primary α-phases heterogeneously nucleated on the convex surface of the Cu ribbon, and then largely grew to the convex surface of the plating layer. The restriction of the primary α-phase's formation was enabled by enhancing the smoothness of the Cu ribbon's surface; it was also possible to increase the adhesive strength and decrease contact resistance. We confirmed that the solar ribbon's surface smoothness depends on the internal Cu ribbon's surface smoothness.

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Investigations of interfacial reactions of Sn–Zn based and Sn–Ag–Cu lead-free solder alloys as replacement for Sn–Pb solder

Cited by 133 publications

References 18 publications

Low Melting Temperature Solder Materials for Use in Flexible Microelectronic Packaging Applications

Low Melting Temperature Solder Materials for Use in Flexible Microelectronic Packaging Applications

Liquid-Phase Reaction Sintering Behavior at below 200 °C and Electrical Sheet Resistance of Sn-58Bi/Cu Composite Pastes

Enhancement of the Surface Smoothness of Cu Ribbon for Solar Cell Modules

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