Investigations of Au-Sn alloys on different end-metallizations for high temperature applications [solders]

Anhock, S.; Oppermann, Hermann; Kallmayer, Christine; Aschenbrenner, R.; Thomas, Ludwig K.; Reichl, H.

doi:10.1109/iemte.1998.723081

Cited by 30 publications

(16 citation statements)

References 3 publications

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“…3 The same binary phases with the solubility of a third element were found in the bulk AuNi-Sn alloys. The results are summarized in Table 1 and compared to those inferred from reported isothermal sections of the ternary phase diagram at room temperature [18] and 400°C. [19] Ni is much more soluble in the ζ-phase than in the δ-phase.…”

Section: A Microstructure Of Bulk Soldermentioning

confidence: 99%

The microstructure of eutectic Au-Sn solder bumps on Cu/electroless Ni/Au

Song

Ahn

Morris

2001

J. Electron. Mater.

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In this work we studied the initial microstructure and microstructural evolution of eutectic Au-Sn solder bumps on Cu/electroless Ni/Au. The solder bumps were 150-160 µm in diameter and 45-50 µm tall, reflowed on Cu/electroless Ni/Au, and then aged at 200 o C for up to 365 days. In addition, Au-Ni-Sn-alloys were made and analyzed to help identify the phases that appear at the interface during aging.The detailed interfacial microstructure was observed using TEM. The results show that the introduction of Au from the substrate produces large islands of ζ-phase in the bulk microstructure during reflow. Two Au-Ni-Sn compounds are formed at the solder/substrate interface and grow slowly during aging. The maximum solubility of Ni in the ζ-phase was measured to be about 1 at.% at 200°C, while Ni in the δ-phase is more than 20 at.%. The electroless Ni layer is made of several sublayers with slightly different compositions and microstructures. There is, in addition, an amorphous interaction layer at the solder/electroless Ni interface.

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Section: A Microstructure Of Bulk Soldermentioning

confidence: 99%

The microstructure of eutectic Au-Sn solder bumps on Cu/electroless Ni/Au

Song

Ahn

Morris

2001

J. Electron. Mater.

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“…A low temperature, high strength soldering approach was developed and tested for this application using 80Au20Sn solder typically used by the microelectronics industry for "eutectic die attachment" [14][15]. This solder has a tensile strength rating of 40 ksi, and a shear rating of 7.2 ksi at a process temperature of 300°C.…”

Section: Conical Buckling Prevention Analysismentioning

confidence: 99%

Advanced Induction Motor Endring Design Features for High Speed Applications

Caprio¹,

Lelos²,

Herbst³

et al. 2005

IEEE International Conference on Electric Machines and Drives, 2005.

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-This paper presents advancements in induction motor endring design to overcome mechanical limitations and extend the operating speed range and joint reliability of induction machines.A novel end ring design met the challenging mechanical requirements of this high speed, high temperature, power dense application, without compromising electrical performance. Analysis is presented of the advanced endring design features including a non uniform cross section, hoop stress relief cuts, and an integrated joint boss, which reduced critical stress concentrations, allowing operation under a broad speed and temperature design range. A generalized treatment of this design approach is presented comparing the concept results to conventional design techniques. Additionally, a low temperature joining process of the bar/end ring connection is discussed that provides the required joint strength without compromising the mechanical strength of the age hardened parent metals. A description of a prototype 2 MW, 15,000 rpm flywheel motor generator embodying this technology is presented.

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“…Hence, the main discrepancy in experimental studies lies in the solubility of the Au in (Au,Ni) 3 Sn 4 . In our study and in the work of Anhock et al, 13) the Au solubility ranges from 3 at% to 12 at%.…”

Section: Thermodynamic Analysismentioning

confidence: 74%

Synthesis of the Combination Solder of 80Au-20Sn/42Sn-58Bi and Thermodynamic Interpretation of the Microstructural Evolution

2008

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A Pb-free combination solder structure was successfully attained from a high-melting 80Au-20Sn solder alloy completely wrapped in a low-melting 42Sn-58Bi solder paste (the numbers of which are all in mass% unless specified). The phases of (Au,Ni) 3 Sn 4 and AuSn 4 were observed at the interface between Sn-Bi solder and Cu/Ni/Au UBM, whereas the (Au,Ni) 3 Sn 2 phase was observed at the interface between AuSn solder and Cu/Ni/Au UBM. The interfacial reaction between the Au-Sn solder and the Sn-Bi solder resulted in the formation of AuSn 2 on the side of the Sn-Bi solder and AuSn on the side of the Au-Sn solder. All of these interfacial reactions were explained with relevant equilibrium phase diagrams. Moreover, we found that there is a limit in the optimum solder volume for a well-defined combination solder structure that can be applied to organic substrates with an increased remelting temperature.

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Investigations of Au-Sn alloys on different end-metallizations for high temperature applications [solders]

Cited by 30 publications

References 3 publications

The microstructure of eutectic Au-Sn solder bumps on Cu/electroless Ni/Au

The microstructure of eutectic Au-Sn solder bumps on Cu/electroless Ni/Au

Advanced Induction Motor Endring Design Features for High Speed Applications

Synthesis of the Combination Solder of 80Au-20Sn/42Sn-58Bi and Thermodynamic Interpretation of the Microstructural Evolution

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