Investigation on Via Arrangements for the Thermal Management of High Current PCBs

Coppola, L.; Schmidt, R.; Cottet, Didier

doi:10.1109/apec.2009.4802702

Cited by 3 publications

(1 citation statement)

References 4 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…As an example, a PCB board experiences localized hot spots due to current crowding. In literature, multi-physics FEM is used to investigate how the copper thickness and placement of vias is crucial to avoid hotspots in high power PCBs [68]- [70]. Following the thermal simulation, it is possible to add mechanical parameters to the materials and solve for the thermo-mechanical induced stress.…”

Section: B Thermo-mechanical Induced Stressmentioning

confidence: 99%

Overview of Digital Design and Finite-Element Analysis in Modern Power Electronic Packaging

Jørgensen

Munk‐Nielsen

Uhrenfeldt

2020

IEEE Trans. Power Electron.

View full text Add to dashboard Cite

Wide band gap semiconductors require packaging with reduced parasitic inductance and capacitance. To achieve this, new packaging solutions are proposed which increase integration. This causes difficulty in measurement of voltages, currents and device temperature, and therefore designers must rely more heavily on simulations to gain insight in the operation of the developed prototypes. Additionally, the use of digital design may reduce the number of physical prototype iterations and thereby reduces development time. Gaining fidelity of 3D multi-physics simulations, reduced order modelling and system simulation aids in the design of working prototypes and pushes performance of new power modules based on wide band gap semiconductor devices. This paper provides an overview and discusses the recent advances in the use of finite element analysis and simulation tools within the topic of power module packaging. The main aspects covered are extraction of electrical parasitics, simulation of transient thermal response and issues related to evaluation of electric fields. An example of a simulation software roadmap is presented which enables accurate electrothermal simulation of new packaging structures that combine conventional power module technology with integrated printed circuit boards. The future challenges for utilizing the potential of digital design are discussed.

show abstract

Section: B Thermo-mechanical Induced Stressmentioning

confidence: 99%