Investigation on thermal contact resistance by photothermal technique at low temperature

Experimental Investigation on Thermoresistance between AlN, Bi-2223 and OFHC in High Tc- Direct Cooling Technology

“…Neither the organizing structure nor property of this interfacial layer is the same as that of the two solids. The author has observed the micro-structure interface joined by copper-aluminium cold-pressing under a scanning electron microscope (SEM) [6,7] and found that the alloy content percentages each 4μm from the two sides of the so-called Cu-Al 2-D interface are: on the Cu side (Al: 16.37%; Cu: 83.63%); on the Al side (Cu: 1.4%, Al: 98.6%). Therefore, in high temperature superconducting direct cooling technology, research on the heat transport process and characteristics at the 3-D cryogenics interfacial layer [6] and the magnitude of the heat resistance at the 3-D cryogenics interfacial layer is of great significance.…”

Determination of time-dependent thermal contact conductance through IR-thermography

“…Another approach utilises the phase lag between a thermal impulse given to one specimen and the corresponding thermal response at the contacting specimen, which can be attributed to the contact heat transfer between the two [15].…”