Investigation on Subsurface Damage Patterns in Ultrashort Pulse Laser Machining of Glass using Optical Coherence Tomography

Abstract

Ultrashort pulse (USP) laser ablation is gaining popularity as a novel manufacturing technique for brittle materials, enabling the creation of complex freeform shapes that are challenging to produce with conventional optics manufacturing techniques. Freeforms have revolutionized optics manufacturing by providing designers with increased degrees of freedom using non-rotational symmetric components. However, this evolution presents new challenges for manufacturing processes, calling for innovative solutions such as USP ablation. To ensure the industrial viability of areal USP laser machining, it is crucial to not only consider material removal rates but also surface quality and subsurface damage (SSD). Especially for optical applications, harsh quality requirements must be met. This study investigates the SSD patterns of fused silica (FS) and borosilicate glass N-BK7 (BK) processed under different laser wavelengths, beam geometries and processing parameters using high-resolution optical coherence tomography (OCT). It is shown that OCT as non-destructive and 3D evaluation method is well-suited for analysing USP processes. The discovered differences in defect morphology between FS and BK emphasize the importance of selecting appropriate processes and process parameters when working with different materials. Compared to previous studies, for the parameter sets analysed here using OCT, much higher defects depths of up to 441 µm were revealed.

Characterization of manufacturing-induced microcracks in optical components

“…During conventional processing (grinding and polishing), damage and microcracks occur near the surface. However, such SSD can also arise in newer manufacturing processes, such as laser machining using ultrashort pulses (USP) for brittle materials [1]. The effects of SSD can be complex.…”