2021
DOI: 10.1016/j.jmrt.2021.11.114
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Investigation on microstructure, mechanical, and tribological performance of Cu base hybrid composite materials

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Cited by 43 publications
(20 citation statements)
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“…Figure 13 shows the relative densities of the sintered pure Al7075 and Al7075-CNTs composites for different milling times. The density of sintered parts, especially MMCs produced by PM methods, has been significantly influenced by seven key parameters, namely; production parameters, matrix and reinforcement properties, interfacial bonding, structural integrity, distribution, destruction of reinforcements, sintering ability, and perhaps most significantly packing ability [54]. The sintered specimen consisting of relatively bigger particles cannot show the full density.…”
Section: Effect Of Milling Time On Properties Of Sintered Compositesmentioning
confidence: 99%
“…Figure 13 shows the relative densities of the sintered pure Al7075 and Al7075-CNTs composites for different milling times. The density of sintered parts, especially MMCs produced by PM methods, has been significantly influenced by seven key parameters, namely; production parameters, matrix and reinforcement properties, interfacial bonding, structural integrity, distribution, destruction of reinforcements, sintering ability, and perhaps most significantly packing ability [54]. The sintered specimen consisting of relatively bigger particles cannot show the full density.…”
Section: Effect Of Milling Time On Properties Of Sintered Compositesmentioning
confidence: 99%
“…Reinforcement particles with a stable structure can thermodynamically improve the mechanical performance of copper matrix composites but have less effect on electrical properties [3]. In recent years, copper matrix composite materials were preferred in many fields, such as engineering materials, thanks to their superior mechanical properties [4]. Copper composites, which are formed by the combination of the excellent elastic modulus of ceramic materials and the high ductility of copper, are used especially in the aerospace and automotive industries [5].…”
Section: Introductionmentioning
confidence: 99%
“…Cu is an ideal metallic base material that mostly used in electrode materials for joining operations and exclusive industrial applications such as electrical devices and electrical packaging due to its superior thermal and electrical conductivity features. 1 However, their poor mechanical and tribological properties especially for extreme temperatures limit the extensive usage of this material group. To extend their usage and improve material properties, various researchers have been utilized different production methods consisting of several strengthening mechanisms.…”
Section: Introductionmentioning
confidence: 99%