Investigation on methods for dealing with pile-up errors in evaluating the mechanical properties of thin metal films at sub-micron scale on hard substrates by nanoindentation technique

Zhou, Xiangyang; Jiang, Zhuangde; Wang, Hairong; Yu, Ruixia

doi:10.1016/j.msea.2008.01.020

Cited by 49 publications

(47 citation statements)

References 37 publications

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“…In their work the effects of film thickness and substrate deformation restraint on the mechanical properties of the electron beam deposited Au and Ag films were examined by using a Berkovich indenter. To examine the residual impression in Au and Al thin films SEM and AFM were used by Zhou et al [27]. They also applied a quantitative approach to deal with the problems with estimating the real contact area, which was developed by Saha and Nix [28].…”

Section: Introductionmentioning

confidence: 99%

“…The basic assumption of this method is that the Young's modulus is independent of the contact area and the contact depth. The hardness can be determined from a measurement of both the load, P and the contact stiffness, S. Zhou et al [27] as well as Saha and Nix [28] used a Berkovich indenter in their experiments. Finally, the large review of experimental techniques for the examination of residual imprints was presented in [29].…”

Section: Introductionmentioning

confidence: 99%

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Decrease of Nano-hardness at Ultra-low Indentation Depths in Copper Single Crystal

et al. 2015

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In the present study, we report a detailed investigation of the unusual size effect in single crystals. For the experiments we specified the hardness in single crystalline copper specimens with different orientations ( (001), (011) and (111)) using Oliver-Pharr method. Our results indicates that with decreasing load, after the value of the hardness reached its maximum, it starts to decrease for very small indentation depths (<150 nm). For the sake of accuracy of hardness determination we have developed two AFM-based methods to evaluate contact area between tip and indented material. The proposed exact measurement of the contact area, which includes the effect of pile-up and sink-in patterns, can partially explain the strange behaviour, however, the decrease of hardness at low loads is still observed. At higher loads range the specified hardness is practically constant.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Decrease of Nano-hardness at Ultra-low Indentation Depths in Copper Single Crystal

et al. 2015

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“…In general, the hardness, H, defined as the load on the indenter normalized with the projected contact area of the hardness impression (see Figure 21), should be independent of the depth of penetration, h. However, over the past 60 years, it was observed that there were significant variations of hardness with respect to penetration depth, especially when the depths decreased to less than a few micro-meters [54][55][56][57][58][59][60]. In addition, two types of indentation size effects have been reported.…”

Section: Nanoindentation Size Effect Of Materialsmentioning

confidence: 99%

“…One is the normal ISE (the tip is pyramidal or conical)-the hardness increases with decreasing penetration depths, according to the expression "smaller is stronger" (see Figure 21). Another one is the reverse ISE (the tip is spherical) [55,56,61], which displayed that the hardness decreases with increasing depths. However, for the reverse ISE, it was observed that the hardness also increases with the decreasing of tip radius.…”

Section: Nanoindentation Size Effect Of Materialsmentioning

confidence: 99%

“…Szlufarska et al [56] performed molecular dynamics simulation of indentation of nano-crystalline silicon carbide predicting a crossover from intergranular continuous deformation to intragrain discrete deformation at a critical indentation depth. Walsh et al [57] relied on MD simulations to probe silicon nitride films reporting amorphization and cracking with a marked anisotropy.…”

Section: Other Materialsmentioning

confidence: 99%

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Crystal Indentation Hardness

2018

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Understanding Nanoscale Plasticity by Quantitative In Situ Conductive Nanoindentation

2021

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Electronic materials such as semiconductors, piezo‐ and ferroelectrics, and metal oxides are primary constituents in sensing, actuation, nanoelectronics, memory, and energy systems. Although significant progress is evident in understanding the mechanical and electrical properties independently using conventional techniques, simultaneous and quantitative electromechanical characterization at the nanoscale using in situ techniques is scarce. It is essential because coupling/linking electrical signal to the nanoscale plasticity provides vital information regarding the real‐time electromechanical behavior of materials, which is crucial for developing miniaturized smarter technologies. With the advent of conductive nanoindentation, researchers have been able to get valuable insights into the nanoscale plasticity (otherwise not possible by conventional means) in a wide variety of bulk and small‐volume materials, quantify the electromechanical properties, understand the dielectric breakdown phenomenon and the nature of electrical contacts in thin films, etc., by continuously monitoring the real‐time electrical signal changes during any point on the indentation load–hold–unload cycle. This comprehensive Review covers probing the electromechanical behavior of materials using in situ conductive nanoindentation, data analysis methods, the validity of the models and limitations, and electronic conduction mechanisms at the nanocontacts, quantification of resistive components, applications, progress, and existing issues, and provides a futuristic outlook.

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Investigation on methods for dealing with pile-up errors in evaluating the mechanical properties of thin metal films at sub-micron scale on hard substrates by nanoindentation technique

Cited by 49 publications

References 37 publications

Decrease of Nano-hardness at Ultra-low Indentation Depths in Copper Single Crystal

Decrease of Nano-hardness at Ultra-low Indentation Depths in Copper Single Crystal

Crystal Indentation Hardness

Understanding Nanoscale Plasticity by Quantitative In Situ Conductive Nanoindentation

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