Investigation on Laser Welding of Al Ribbon to Cu Sheet: Weldability, Microstructure, and Mechanical and Electrical Properties

Shin, Won-Sang; Cho, Dae-Won; Jung, Dong Soo; Kang, Hee-Shin; Kim, Jeng O; Kim, Yoon Jun; Park, Changkyoo

doi:10.3390/met11050831

Cited by 12 publications

(3 citation statements)

References 38 publications

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“…Al sheet is widely selected as the top material to irradiate by the laser beam because of its relatively high absorption to laser radiation (1030 nm) and low meting point (660 o C) in comparison to Cu. To obtain a good joint with Al to Cu is to irradiate laser from Aluminum (Al) to control the weld depth and mixing of Cu in Al [1,2].…”

Section: Introductionmentioning

confidence: 99%

Welding of Copper to Aluminium With Laser Beam Wavelength of 515 nm

Mathivanan¹,

Plapper²

2021

Preprint

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In laser joining of copper (Cu) and aluminum (Al) sheets, the Al sheet is widely chosen as the top surface for laser irradiation because of increased absorption of laser beam and lower melting temperature of Al in contrast to Cu. This research focus on welding from Cu side to Al sheet. The main objective of irradiating the laser beam from the copper side (Cu on top) is to exploit higher solubility of Al in Cu. A significantly lower laser power can be used with 515 nm laser in comparison to 1030 nm. In addition to low laser power, a stable welding is obtained with 515 nm. Because of this advantage, 515 nm is selected for the current research. By fusion of Cu and Al the two sheet metals are welded, with presence of beneficial Cu solid solution phase and Al+Al2Cu in the joint with the brittle phases intermixed between the ductile phase. Therefore the mixed composition strengthens the joint. However excessive mixing leads to formation of more detrimental phases and less ductile phases. Therefore optimum mixing must be maintained. Energy dispersive X-ray spectroscopy (EDS) analysis indicate that large amount of beneficial Cu solid solution and Al rich phases is formed in the strong joint. From the tensile shear test for a strong joint, fracture is obtained on the heat-affected zone (HAZ) of Al. Therefore the key for welding from copper side is to have optimum melt with beneficial phases like Cu and Al+ Al2Cu and the detrimental phases intermixed between the ductile phases

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Section: Introductionmentioning

confidence: 99%

Welding of Copper to Aluminium With Laser Beam Wavelength of 515 nm

Mathivanan¹,

Plapper²

2021

Preprint

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“…In the case of the Cu-based filler, the weld zone exhibited a uniform structure characterized by the presence of the Cu solid solution phase and exhibited the highest tensile strength, reaching up to 80% of the tensile strength of pure copper. W. S. Shin et al [7]examined pulsed laser welding of aluminum to copper sheets and found that electron probe microanalysis and transmission electron microscopy confirmed the presence of intermetallic compounds, including Al4Cu9, Al2Cu, and AlCu. C. Zhang et al [4] investigated the diffusion bonding of Cu/Ni-based superalloys at 900°C for 1 hour under a bonding pressure of 10 MPa and observed that failure occurred in the Cu superalloys.…”

Section: Introductionmentioning

confidence: 99%

Mechanical and Microstructural Characterization of Diffusion-Bonded Copper-Nickel Joint Interface

Khan,

Ali,

Rehman

et al. 2024

AMR

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Solid-state diffusion bonding effectively joins dissimilar materials, even with varying metallurgical properties and melting points. In this study, a Cu/Ni joint was produced at a bonding temperature of 950°C for 60 minutes under a vacuum. The microstructural and mechanical properties of the bonding interface were evaluated using scanning electron microscopy (SEM) equipped with energy-dispersive spectroscopy (EDS), microhardness tests, and X-ray diffraction (XRD). It was found that the EDS point scan analysis revealed the formation of a solid solution of Cu-Ni at the bonding interface. Since Cu-Ni exhibit complete solubility with each other, no intermetallic compounds (IMCs) were formed. The microhardness indicated that the bonding interface had a microhardness of 20% and 54% higher than the base metals (BM) of Ni and Cu, respectively.

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“…Meanwhile, the brittle intermetallic compounds (IMCs) are easily formed, which seriously deteriorates the mechanical properties and the conductivity of the Al/Cu joints [8,9]. In the present study, different welding methods, in case of diffusion bonding (DB) [10], brazing [11,12], friction stir welding (FSW) [13][14][15], laser welding [16], and explosion welding (EW) [17,18], have been proved to be an alternative method in joining Al and Cu. ese studies have shown that it was inevitable to form the hard and brittle Al x Cu y phases such as Al 2 Cu, AlCu, Al 4 Cu 9 , and Al 3 Cu 4 on the interface of Cu/Al joints.…”

Section: Introductionmentioning

confidence: 99%

Study on the Thermal Conductivity of Cu/Al Joints with Different Interfacial Microstructures

Wei

Chen

Niu

et al. 2022

Advances in Materials Science and Engineering

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Three types of Cu/Al joints with different interfacial microstructures prepared by diffusion bonding, friction stir welding, and explosive welding were obtained, and the interfacial thermal conductivity was emphatically discussed in this paper. Two layers of intermetallic compounds with a width of 5∼12 μm were formed in the joint prepared by diffusion bonding. And a mixture of a supersaturated solid solution and few dispersed compounds with a thickness less than 1 μm was formed in the friction stir welding Cu/Al joint. The bonding interface of the Cu/Al explosive welding joint presented a wavy-like morphology with a width of 300∼350 μm. The interfacial thermal conductivity with different interfacial microstructure was calculated analytically using the acoustic mismatch model and compared with the measured value of the joints. The interfacial thermal conductivity mainly depends on the type of interfacial phase and its thickness. The calculated result showed that the interfacial thermal conductivity of friction stir welding joint was the highest (1∼8 × 107 W m−2·K−1). The experiment results suggested that the interfacial thermal conductivity showed the trend that explosive welding < friction stir welding < diffusion bonding.

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Investigation on Laser Welding of Al Ribbon to Cu Sheet: Weldability, Microstructure, and Mechanical and Electrical Properties

Cited by 12 publications

References 38 publications

Welding of Copper to Aluminium With Laser Beam Wavelength of 515 nm

Welding of Copper to Aluminium With Laser Beam Wavelength of 515 nm

Mechanical and Microstructural Characterization of Diffusion-Bonded Copper-Nickel Joint Interface

Study on the Thermal Conductivity of Cu/Al Joints with Different Interfacial Microstructures

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