Abstract:Novel 3D packaging technologies which require largearea mold embedding are being developed in order to achieve further minimization and cost reductions. Compression molding using epoxy molding compounds is one technique being considered for wafer-level encapsulation. However significant warpage in molded wafers is a critical issue which may hinder successive processes from being carried out. Cases of both symmetric (spherical) and asymmetric (cylindrical)-shaped warpage have been reported in wafer-level compre… Show more
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