Investigation of ultrasound-assisted soldering of SiC ceramics by Zn-Al-In high-temperature solder

Dependence of wetting on cavitation during the spreading of a filler droplet on the ultrasonically agitated Al substrate

“…Wetting is realized by removing the oxide layer on the surface of the substrate [5] . Since its first development, ultrasonic-assisted soldering has been successfully used to join various types of materials, such as Al alloys [6] , [7] , Mg alloys [8] , Ti alloys [9] , ceramics [10] , [11] , and sapphire. However, the mechanism of oxide layer removal via ultrasonication remains unclear.…”

Sonoprocessing of wetting of SiC by liquid Al: A thermodynamic and kinetic study

“…For liquid metals with poor wettability, sonoprocessing changes their flow behaviors and increases the systematic energy used for spreading [17] , [18] , [19] . For other liquis metals such as Al–10Cu or Bi–8Zn, they can spontaneously spread on solid substrates [20] , [21] , but the viscosity relates with the wetting tendency and it is unique for each liquid alloy.…”