Investigation of the thermal decomposition of printed circuit boards (PCBs) via thermogravimetric analysis (TGA) and analytical pyrolysis (Py–GC/MS)

Evangelopoulos, Panagiotis; Kantarelis, Efthymios; Yang, Weihong

doi:10.1016/j.jaap.2015.08.012

Cited by 126 publications

(47 citation statements)

References 19 publications

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“…Pyrolysis processes for WPCBs have been reported in many scientific publications: Vacuum pyrolysis [157], nitrogen supply pyrolysis, nitrogen supply oxidative pyrolysis, and oxygen supply [82]. Evangelopoulos et al [158] used thermogravimetric analysis (TGA) and analytical pyrolysis (Py-GC/MS) to investigate the pyrolytic activity of PCB waste fractions at a temperature range of 400 • C to 900 • C. The experimental results indicate that the PCBs' chemical composition and relatively high ash content are strongly linked to the high metal and ceramic content quantities. PCB pyrolysis reveals a range of aromatic compounds like bisphenol A, styrene, phenol, methylstyrene, bromophenol, together with non-aromatic compounds like bromomomethane and acetone.…”

Section: Pyrolysis Processmentioning

confidence: 99%

Advanced Recovery Techniques for Waste Materials from IT and Telecommunication Equipment Printed Circuit Boards

2019

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Waste from information technology (IT) and telecommunication equipment (WITTE) constitutes a significant fraction of waste from electrical and electronic equipment (WEEE). The presence of rare metals and hazardous materials (e.g., heavy metals or flame retardants) makes the necessary recycling procedures difficult and expensive. Important efforts are being made for Waste Printed Circuit Board (WPCB) recycling because, even if they only amount to 5-10% of the WITTE weight, they constitute up to 80% of the recovered value. This paper summarizes the recycling techniques applicable to WPCBs. In the first part, dismantling and mechanical recycling techniques are presented. Within the frame of electro-mechanical separation technology, the chain process of shredding, washing, and sieving, followed by one or a combination of magnetic, eddy current, corona electrostatic, triboelectrostatic, or gravity separation techniques, is presented. The chemical and electrochemical processes are of utmost importance for the fine separation of metals coming from complex equipment such as WPCBs. Thermal recycling techniques such as pyrolysis and thermal treatment are presented as complementary solutions for achieving both an extra separation stage and thermal energy. As the recycling processes of WPCBs require adequate, efficient, and ecological recycling techniques, the aim of this survey is to identify and highlight the most important ones. Due to the high economic value of the resulting raw materials relative to the WPCBs' weight and composition, their recycling represents both a necessary environmental protection action, as well as an economic opportunity.

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Section: Pyrolysis Processmentioning

confidence: 99%

Advanced Recovery Techniques for Waste Materials from IT and Telecommunication Equipment Printed Circuit Boards

2019

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“…The chromatograms of pyrolysis products at 500°C and their identifications are shown in Figure and Tables and , respectively. Figure A shows that in low retention times (Rt) at 1.84 and 2.52 minutes, 3001‐OH molecules were decomposed into the fragments with m / z at 58 and 72 assigned to acetone, propionaldehyde, and 2‐oxopropanal, respectively, which come from the thermal decomposition of poly(oxypropylene) chains in the 3001‐OH . The fragments with m / z at 212, 213, and 197 were assigned to phenolic derivatives and its free radicals.…”

Section: Resultsmentioning

confidence: 99%

“…Figure 12A shows that in low retention times (Rt) at 1.84 and 2.52 minutes, 3001-OH molecules were decomposed into the fragments with m/z at 58 and 72 assigned to acetone, propionaldehyde, and 2-oxopropanal, respectively, which come from the thermal decomposition of poly(oxypropylene) chains in the 3001-OH. 39 The fragments with m/z at 212, 213, and 197 were assigned to phenolic derivatives and its free radicals. Then, these phenolic derivatives could further decompose to new fragments such as phenol (m/z = 94), 4-isopropylphenol (m/z = 134), and 4-(1methylethenyl) phenol (m/z = 136).…”

Section: Analysis Of Flame Retardant Mechanism In Gaseous Phasementioning

confidence: 99%

Preparation, flame retardancy, and thermal and mechanical properties of polyurethane containing phosphonated bisphenol‐A units

2018

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Summary A novel phosphonated bisphenol‐A glycol (3001‐OH) was synthesized by the ring opening reaction between α,ω‐phenol‐terminated aromatic polyphosphonate and propylene oxide. 3001‐OH was then incorporated into polyurethanes (PUs) as soft segments, and the effects of 3001‐OH on the flame retardancy and thermal and mechanical properties of PUs were investigated. The tensile strength and Young modulus of PUs are improved with the incorporation of 3001‐OH into the PUs. With the increase of 3001‐OH content in the PUs, the glass transition temperature of the soft segments increases, and the phase separation degree between the hard and soft segments decreases. The limiting oxygen index values of PUs increase from 23.1% to 29.6%, while total heat release values from micro‐scale combustion calorimeter decrease from 24.3 to 21.5 kJ g−1. And the PUs containing phosphorus element successfully met UL‐94 V‐0 rating requirements. The thermal degradation behaviors and flame retardant mechanism of 3001‐OH were studied by thermal gravimetric analysis and pyrolysis gas chromatography/mass spectrometry coupled with the morphology and chemical analysis of the char residues. The results confirm that 3001‐OH exerts gaseous‐phase and condensed‐phase flame retardant effects on the PUs.

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“…There are several studies which investigated the behavior of different WEEE, such as printed circuit boards, keyboards, video cards, and telephone line at different temperatures [104][105][106]. In the case of printed circuit boards, it was observed that the mass loss ends at a percentage of almost 70% of the initial mass and the higher mass loss rate occurs at temperatures between 250 and 370 • C [105].…”

Section: Thermal Analysismentioning

confidence: 99%

Waste Electrical and Electronic Equipment: A Review on the Identification Methods for Polymeric Materials

et al. 2019

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Considering that the large quantity of waste electrical and electronic equipment plastics generated annually causes increasing environmental concerns for their recycling and also for preserving of raw material resources, decreasing of energy consumption, or saving the virgin materials used, the present challenge is considered to be the recovery of individual polymers from waste electrical and electronic equipment. This study aims to provide an update of the main identification methods of waste electrical and electronic equipment such as spectroscopic fingerprinting, thermal study, and sample techniques (like identification code and burning test), and the characteristic values in the case of the different analyses of the polymers commonly used in electrical and electronic equipment. Additionally, the quality of the identification is very important, as, depending on this, new materials with suitable properties can be obtained to be used in different industrial applications. The latest research in the field demonstrated that a complete characterization of individual WEEE (Waste Electric and Electronic Equipment) components is important to obtain information on the chemical and physical properties compared to the original polymers and their compounds. The future directions are heading towards reducing the costs by recycling single polymer plastic waste fractions that can replace virgin plastic at a ratio of almost 1:1.

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Investigation of the thermal decomposition of printed circuit boards (PCBs) via thermogravimetric analysis (TGA) and analytical pyrolysis (Py–GC/MS)

Cited by 126 publications

References 19 publications

Advanced Recovery Techniques for Waste Materials from IT and Telecommunication Equipment Printed Circuit Boards

Advanced Recovery Techniques for Waste Materials from IT and Telecommunication Equipment Printed Circuit Boards

Preparation, flame retardancy, and thermal and mechanical properties of polyurethane containing phosphonated bisphenol‐A units

Waste Electrical and Electronic Equipment: A Review on the Identification Methods for Polymeric Materials

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