Investigation of the sustaining mechanisms of dc magnetron discharges and consequences for<i>I</i>–<i>V</i>characteristics

Musschoot, Jan; Depla, Diederik; Buyle, Guy; Haemers, Johan; Gryse, Roger De

doi:10.1088/0022-3727/41/1/015209

Cited by 12 publications

(7 citation statements)

References 23 publications

(32 reference statements)

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“…The cylindrical magnetron lies along the z-axis with the magnets oriented toward the positive x-axis (θ = 0 • ). The magnet configuration is described in [4] and consists of cuboid Fe-Nd-B magnets placed on a soft iron yoke. Deposition rates (Å s −1 ) were measured with a quartz crystal microbalance (Maxteck, Inc. Thickness monitor model TM-350) facing the target.…”

Section: Methodsmentioning

confidence: 99%

“…The ejection positions of the sputtered particles are generated from the incident ion distribution at the target surface. This distribution was calculated using the test electron MCcode described in [3,4]. Multiplication of the incident ion distribution with the total ion current I i = I/(1 + γ ), with I the discharge current and γ the effective secondary electron emission coefficient, gives the ion current density j i at the target surface.…”

Section: Initial Propertiesmentioning

confidence: 99%

“…The racetrack, or the incident ion distribution, has already been simulated by Musschoot et al 1 Postdoctoral fellow of the Research Foundation Flanders/FWO. [3,4]. This paper expands the magnetron model by presenting a neutral test-particle Monte Carlo (MC) code to describe the transport of the sputtered particles through the gas phase.…”

Section: Introductionmentioning

confidence: 99%

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The metal flux from a rotating cylindrical magnetron: a Monte Carlo simulation

Aeken¹,

Mahieu²,

Depla³

2008

J. Phys. D: Appl. Phys.

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168

111

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A Monte Carlo simulation of the metal flux from a small scale rotating cylindrical magnetron is presented. The model describes the sputtered particles trajectories through the gas in a user definable 3D set-up. The ejection positions of the sputtered particles are generated according to the simulated ion current density on the target. The thermal motion of the background gas is included, with collisions modelled based on either quantum chemical or screened Coulomb interaction potentials. Experimental characterization of the metal flux was performed for Cu, Al and Ti targets at a range of argon pressures (0.3–1 Pa) by measuring deposition rate distributions. A comparison with preliminary simulations showed the importance of a correct description of the nascent angular distribution of the sputtered particles. Therefore, this distribution was not considered as given by sputter simulation or analytical formula, but was instead reconstructed from the low pressure experimental deposition profiles. The typical heart-like shaped emission observed at low energy sputtering was found and a comparison was made with results from binary collision approximation modelling. The spatial, pressure and material dependence of the metal flux in the chamber was then simulated and found to be in good agreement with the experiment.

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Section: Methodsmentioning

confidence: 99%

Section: Initial Propertiesmentioning

confidence: 99%

See 1 more Smart Citation

The metal flux from a rotating cylindrical magnetron: a Monte Carlo simulation

Aeken¹,

Mahieu²,

Depla³

2008

J. Phys. D: Appl. Phys.

Self Cite

168

111

View full text Add to dashboard Cite

show abstract

“…We used a stand-alone single particle Monte Carlo algorithm (similar to that of Miranda et al [27]) in order to determine the collision rate constants of the fast electrons with the initial energy eU s . We also account for an increase in the number of ions generated by a single fast electron due to creation of electron-ion pairs in the sheath [33]. The multiplication factor m = 1 + kx 2 C , where the sheath thickness x C is calculated from the collisionless Child-Langmuir law and the fitting constant k = 1 mm −2 was estimated by comparison with experimental waveforms.…”

Section: Model Geometry and Equationsmentioning

confidence: 99%

Effect of the target power density on high-power impulse magnetron sputtering of copper

Kozák

2012

Plasma Sources Sci. Technol.

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We present a model analysis of high-power impulse magnetron sputtering of copper. We use a non-stationary global model based on the particle and energy conservation equations in two zones (the high density plasma ring above the target racetrack and the bulk plasma region), which makes it possible to calculate time evolutions of the averaged process gas and target material neutral and ion densities, as well as the fluxes of these particles to the target and substrate during a pulse period. We study the effect of the increasing target power density under conditions corresponding to a real experimental system. The calculated target current waveforms show a long steady state and are in good agreement with the experimental results. For an increasing target power density, an analysis of the particle densities shows a gradual transition to a metal dominated discharge plasma with an increasing degree of ionization of the depositing flux. The average fraction of target material ions in the total ion flux onto the substrate is more than 90% for average target power densities higher than 500 W cm −2 in a pulse. The average ionized fraction of target material atoms in the flux onto the substrate reaches 80% for a maximum average target power density of 3 kW cm −2 in a pulse.

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“…In this case, η = 59.12 cm −2 . Musschoot et al 17 repotted the value of η = 2.4 mm −2 depends on the geometry and magnetic field.…”

Section: Resultsmentioning

confidence: 99%

Correlation between Magnetron Discharge and Characteristics of Alloy (Ti,Cu)N Nano-Structure Thin Films

Rahmati

2016

ECS J. Solid State Sci. Technol.

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Reactive magnetron sputtering using an alloy TiCu target and nitrogen as working gas was utilized to deposit ternary (Ti,Cu)N thin films. The aim of present work is to provide insight into the significance of nitrogen pressure, Ti addition, reflected neutral particles and energy flux on the characteristic of (Ti,Cu)N films. The ion induced secondary electron emission and surface poisoning of TiCu target were studied using I- V characteristic of magnetron discharge. The dependence of sputtering yield of Cu, Ti and TiCu target on incident angle of ions was simulated. Elemental titanium to copper (Ti:Cu) ratio in (Ti,Cu)N films was estimated using a model based on sputtering and mass transport. An estimation of energy flux due to reflected N neutrals toward substrate was presented. The structural analysis was identified using X- ray diffraction (XRD) technique. Phase identity is strongly depending on nitrogen pressure. Ti accommodation to Cu3N structure results in lattice constant expansion and (100) preferential orientation (texture growth). The Bonding environment of pure and Ti inserted Cu3N thin films were obtained from Raman spectroscopy. The Surface morphology and chemical composition of the films were studied by scanning electron microscope/energy dispersive X-ray spectroscopy (SEM/EDX), respectively. Ti addition deforms pyramidal- like grains to spherical ones. The optical study was performed by UV- Vis- near IR transmittance spectroscopy. Ti addition to Cu3N structure kills indirect semiconducting transition and governs the direct bandgap around 2.75 eV. Ti entrance results in interstitial N excess (N-richness) which acts as acceptor centers cause to hole injection to valence band (excited semiconductor) and bandgap widening. Electrical resistance of (Ti,Cu)N thin films shows quasi-metallic behavior. Grain boundary sliding causes to decrease in hardness of (Ti,Cu)N thin films.

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Investigation of the sustaining mechanisms of dc magnetron discharges and consequences forI–Vcharacteristics

Cited by 12 publications

References 23 publications

The metal flux from a rotating cylindrical magnetron: a Monte Carlo simulation

The metal flux from a rotating cylindrical magnetron: a Monte Carlo simulation

Effect of the target power density on high-power impulse magnetron sputtering of copper

Correlation between Magnetron Discharge and Characteristics of Alloy (Ti,Cu)N Nano-Structure Thin Films

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