Investigation of the stress intensity factor changing on the hole crack subject to laser shock processing

Effects of laser peening with different coverage areas on fatigue crack growth properties of 6061-T6 aluminum alloy

“…When It indicates that the improvement of FCG resistance induced by LP can be separated into a relatively large increase in the initial FCG stage and a small increase in the final FCG stage. In the initial FCG stage, compressive residual stresses induced by LP can cause the crack closure and incur the reduction of effective driving force, which is favorable for the reduction of SIF range and FCG rate [25][26][27]. Moreover, LP coverage area significantly affected the FCG rate in the initial FCG stage, the decrement of FCG rate induced by LP-3 is more evident than LP-1 and LP-2.…”

“…For the notched samples, the superposition principle is often used to determine the stress intensity factor (SIF) subject to combined effects of external applied stress and residual stress [25,26]. Zhang et al [27] introduced a weight function method to investigate the relationship between the SIF and compressive residual stresses induced by LP, and the effective SIF was used to evaluate the FCG properties. Combined with the above-mentioned experimental results, it is concluded that LP coverage area significantly affect the effective SIF along the FCG path, which have an important influence on the FCG properties.…”

Surface topography evolution of Ni-based single crystal superalloy under laser shock: Formation of the nano-scale surface reliefs

“…The principle of LSP has been expounded by many researchers [6,20]. In this study, the shockwaves were induced by Nd:YAG laser system (SIA, CAS, Shenyang, China) with wavelength of 1064 nm, frequency of 2 Hz and full-width at half-maximum of about 14 ns.…”

The effects of residual stress on fatigue behavior and crack propagation from laser shock processing-worked hole

“…The influence of compressive stress effect of plastic deformation zone on stress intensity facto of the hole edge was investigated [12], and the next results showing the influence of compressive stress on the 3D non-through hole-edge crack's SIF after LSP [13].…”