2021 23rd European Microelectronics and Packaging Conference &Amp; Exhibition (EMPC) 2021
DOI: 10.23919/empc53418.2021.9584961
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Investigation of the long-term adhesion and barrier properties of a PDMS-Parylene stack with PECVD ceramic interlayers for the conformal encapsulation of neural implants

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“…Thus, further improvement at the interface between Parylene C and silicone is needed. This could be achieved by the addition of PECVD ceramic interlayers [42,43]. Alternatively, TFE2 could be modified to finish at one of the Al 2 O 3 and TiO 2 ALD layers instead of Parylene C.…”
Section: Lcp-tfe2-siliconementioning
confidence: 99%
“…Thus, further improvement at the interface between Parylene C and silicone is needed. This could be achieved by the addition of PECVD ceramic interlayers [42,43]. Alternatively, TFE2 could be modified to finish at one of the Al 2 O 3 and TiO 2 ALD layers instead of Parylene C.…”
Section: Lcp-tfe2-siliconementioning
confidence: 99%