Investigation of the Film Cooling Performance of Laminated SiCfSiC Composite Plates

Abstract

Silicon carbide fiber-reinforced silicon carbide matrix ceramic composites (SiCf/SiC) are extensively utilized in high-temperature resistant materials in the aerospace industry. This study investigated the influence of stacking structure on the performance of SiCf/SiC laminated composite plates with film cooling. Initially, the thermal conductivity of cross-piled SiCf/SiC composites was determined using the laser flash analysis (LFA) method and differential scanning calorimetry (DSC) method. Subsequently, a representative volume element (RVE) model that reflected the stacking structure was established. The anisotropic thermal conductivity of the unidirectional SiCf/SiC layer was calculated using numerical methods and experimental results. Finally, numerical simulations were carried out to assess the film cooling effectiveness of various stacking sequences and layers. The results showed that the thermal conductivity values predicted by the RVE model for the laminated composite aligned well with the experimental results, and the unidirectional SiCf/SiC composite thermal conductivities at different temperatures were obtained. The stacking sequence impacted the temperature distribution near the film hole, with the [0-90-0] structure exhibiting a more pronounced effect on film cooling performance compared with the [0-90] and [0-90-90-0] structures. The performance of the film cooling in the laminated SiCf/SiC composites was consistent across all stacking layers [0-90]1, [0-90]2, and [0-90]3. The maximum difference in overall cooling efficiency was 1.7% between [0-90-0]1 and [0-90]1 and [0-90-90-0]1