Investigation of the Electroless Nickel Plated Sic Particles in Sac305 Solder Matrix

Pal, Manoj Kumar; Gergely, Gréta; Koncz-Horváth, Dániel; Gácsi, Zoltán

doi:10.1007/s11106-020-00107-y

Cited by 22 publications

(5 citation statements)

References 23 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…They concluded liquid sn-zn alloys need protective environment for good wetting of metallic substrates [44]. more recently, similar experimental results were also reported in [45][46] where the focus was kept on formation of intermetallic layers during the wetting by sn-alloys.…”

Section: Introductionsupporting

confidence: 54%

Archives of Metallurgy and Materials

Varanasi,

Aldawoudi,

Baumli

et al. 2020

View full text Add to dashboard Cite

NoN-wettiNg to wettiNg traNsitioN temperatures of Liquid tiN oN surfaces of differeNt steeL sampLes correspoNdiNg to their spoNtaNeous deoxidatioNThe goal of this paper is to measure the non-wetting to wetting transition temperatures of liquid tin on surfaces of different steel samples in vacuum with residual pressure of 10 -8 bar. The experiments were conducted on four steels (C45, s103, CK60 and EN1.4034) of varying compositions using pure tin (99.99%) by the sessile drop method. Non-wetting to wetting transition (contact angle decreasing below 90°) by liquid tin was observed as function of increasing temperature in the range of 820-940 K for low alloyed steels C45, s103 and CK60, while it was considerably higher (around 1130 K) for high chromium EN1.4034 steel. it is concluded that at about the same temperatures, the surfaces of the steel samples are spontaneously deoxidized due to the combined effect of high temperature, low vacuum and C-content of steels. After the oxide layer is removed, the contact angles of liquid tin on steel surfaces were found in the range of 45-80° for low alloyed C45, s103 and CK60 steels and around 20° for high chromium EN1.4034 steel. These relatively high contact angle values compared to other metal/metal couples (such as liquid Cu on steels) are due to the formation of not fully metallic intermetallic compounds (Fesn and Fesn 2 ) at the interface (such do not form in the Cu/Fe system).

show abstract

Section: Introductionsupporting

confidence: 54%

Archives of Metallurgy and Materials

Varanasi,

Aldawoudi,

Baumli

et al. 2020

View full text Add to dashboard Cite

show abstract

“…Historically, Pb-Sn solders have been widely used in the electronics industry due to low melting point, excellent solderability, good electrical conductivity, and low cost [25][26][27][28][29] . However, Lead is a toxic metal, pollutes the environment and endangers human health [30] and thus, many countries have banned Pb-Sn solders [31][32][33] .…”

Section: Lead-free Solder Alloysmentioning

confidence: 99%

Divide and conquer： Machine learning accelerated design of lead-free solder alloys with high strength and high ductility

Zhang

Wei

Cao

et al. 2023

Preprint

View full text Add to dashboard Cite

The attainment of both high strength and high ductility is always the goal for structure materials, because the two properties generally are mutually competing, called strength-ductility trade-off. Nowadays, the data-driven paradigm combined with expert domain knowledge provides the state-of-the-art methodology to design and discovery for structure materials with high strength and high ductility. To enhance both strength and ductility, a joint feature is proposed here to be the product of strength multiplying ductility. The strategy of “divide and conquer” is developed to solve the contradictory problem, that material experimental data of mechanical behaviors are, in general, small in size and big in noise, while the design space is huge, by a newly developed data preprocessing algorithm, named the Tree-Classifier for Gaussian Process Regression (TCGPR). The TCGPR effectively divides an original dataset in a huge design space into three appropriate sub-domains and then three Machine Learning (ML) models conquer the three sub-domains, achieving significantly improved prediction accuracy and generality. After that the Bayesian sampling is applied to design next experiments by balancing exploitation and exploration. Finally, the experiment results confirm the ML predictions, exhibiting novel lead-free solder alloys with high strength high ductility. Various material characterizations were also conducted to explore the mechanism of high strength and high ductility of the alloys.

show abstract

“…Coated ceramics production is reasonable for the PM procedure. SiC particles were coated independently with nickel via an electroless technique [20,21]. Table 1 shows the process of Ni-coating on silicon carbide particles.…”

Section: Materials and Experimental Proceduresmentioning

confidence: 99%

Distribution and Microstructure Analysis of Ceramic Particles in the Lead‐Free Solder Matrix

Pal

Gergely

Koncz-Horváth

et al. 2020

Crystal Research and Technology

Self Cite

View full text Add to dashboard Cite

The Sn-3.5Ag-0.5Cu (SAC305) solder alloy is a prominent candidate for the Pb-free solder, and SAC305 solder is generally employed in today's electronic enterprise. In this study, the formation of intermetallic compounds (Cu 6 Sn 5 and Ag 3 Sn) in the solder (bulk area), average neighboring particle distance, and the morphological mosaic are examined by the addition of silicon carbide (SiC) and nickel-coated SiC reinforcements within Sn-3.5Ag-0.5Cu solder. Results reveal that the addition of SiC and SiC(Ni) particles is associated with a small change to the average neighboring particle distance and a decrease in clustering rate to a certain limit of the Sn-3.5Ag-0.5Cu solder composites. Moreover, the development of the Cu 6 Sn 5 and the structure of the Ag 3 Sn are improved with the addition of SiC and Ni-coated SiC.

show abstract

Investigation of the Electroless Nickel Plated Sic Particles in Sac305 Solder Matrix

Cited by 22 publications

References 23 publications

Archives of Metallurgy and Materials

Archives of Metallurgy and Materials

Divide and conquer： Machine learning accelerated design of lead-free solder alloys with high strength and high ductility

Distribution and Microstructure Analysis of Ceramic Particles in the Lead‐Free Solder Matrix

Contact Info

Product

Resources

About