2017
DOI: 10.1016/j.cirp.2017.04.018
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Investigation of the cutting mechanisms and the anisotropic ductility of monocrystalline sapphire

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Cited by 47 publications
(16 citation statements)
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“…It needs to be mentioned that the stress distribution in Figure 1 is a simplified illustration, whereas the actual stress distribution would be much more complicated. The stress distribution in a practical machining process would not only be influenced by the machining conditions, but also be affected by the crystal anisotropy [ 5 , 38 , 40 , 41 , 42 , 43 , 44 ]. Nevertheless, compression and tension would still exist in the zones before and behind the tool respectively.…”
Section: Mechanics Of Brittle–ductile Cutting Mode Transitionmentioning
confidence: 99%
See 1 more Smart Citation
“…It needs to be mentioned that the stress distribution in Figure 1 is a simplified illustration, whereas the actual stress distribution would be much more complicated. The stress distribution in a practical machining process would not only be influenced by the machining conditions, but also be affected by the crystal anisotropy [ 5 , 38 , 40 , 41 , 42 , 43 , 44 ]. Nevertheless, compression and tension would still exist in the zones before and behind the tool respectively.…”
Section: Mechanics Of Brittle–ductile Cutting Mode Transitionmentioning
confidence: 99%
“…Brittle–ductile cutting mode transition is an important phenomenon in the ultra-precision machining of brittle materials [ 1 , 2 , 3 , 4 ]. Almost all the brittle materials could be machined in the ductile mode when the undeformed chip thickness ( ) decreases to be sufficiently small, typically at submicron level [ 5 , 6 , 7 ]. The mechanism of brittle–ductile cutting mode transition has been a hot topic over the past two decades, and has been explained from several perspectives, including the energy of the material removal, the effects of the preexisting microdefects, and the effective rake angle at small undeformed chip thickness, etc.…”
Section: Introductionmentioning
confidence: 99%
“…Wen Gu et al improved the assessment of the brittle-ductile transition based on the surface conditions using a method of changing the position to observe the two-dimensional plane with an optical microscope and then calculating the BDTD of the material by extracting the envelope curve [ 19 ]. Three-dimensional microscopic measurement methods mainly use a scanning electron microscope (SEM), atomic force microscope (AFM), transmission electron microscope (TEM), etc., as well as a white light interferometer, laser confocal measuring instrument, or other three-dimensional scanning equipment for performing measurements; then, according to the three-dimensional information, the position of the brittle-ductile transition point is judged, and the BDTD is obtained [ 20 , 21 , 22 , 23 ]. For example, Fang et al used an SEM and AFM to observe a surface after taper cutting and obtained the critical cutting thickness of the brittle-ductile transition during the nano-cutting of single-crystal silicon [ 24 , 25 ].…”
Section: Introductionmentioning
confidence: 99%
“…Although comprehensive research has been carried out to study elastic-plastic deformation behavior in the static state by indentation, few studies have concentrated on sapphire anisotropy under the dynamic state [ 11 , 12 ]. Mizumoto, et al [ 13 ] discussed the anisotropic deformation behavior of monocrystalline sapphire by plunge-cut tests in brittle–ductile transition. Nanoscratch is becoming a promising characterization method to analyze wear behavior and the nano-tribological property of a material under the dynamic state [ 14 , 15 ].…”
Section: Introductionmentioning
confidence: 99%