2022
DOI: 10.3390/ma15072496
|View full text |Cite
|
Sign up to set email alerts
|

Investigation of the Anisotropy of 4H-SiC Materials in Nanoindentation and Scratch Experiments

Abstract: Silicon carbide is an ideal material for advanced electronics, military, and aerospace applications due to its superior physical and chemical properties. In order to understand the effect of crystal anisotropy of 4H-SiC on its processability, nanoindentation and nanoscratch tests on various crystallographic planes and orientations were performed and the results outlined in this paper. The results show that the C-plane of 4H-SiC is more rigid, while the Si-plane is more elastic and ductile. Better surface quali… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1

Citation Types

0
3
0

Year Published

2022
2022
2025
2025

Publication Types

Select...
7

Relationship

0
7

Authors

Journals

citations
Cited by 14 publications
(3 citation statements)
references
References 13 publications
(13 reference statements)
0
3
0
Order By: Relevance
“…Most importantly, the resulting MRRs on the 6H-SiC Si-face and C-face surfaces were equal to 6.13 nm m −1 and 13.94 nm m −1 , respectively, indicating that C-face is indeed easier to remove than Si-face [ 5 ]. In 2022, Shi et al investigated the mechanical properties of different crystal orientations on a polished 4H-SiC wafer by using the nano-indentation and nano-scratching methods [ 6 ]. It was found that a larger elastic modulus leads to less material deformation, and therefore, a harder characteristic.…”
Section: Various Sic Cmp Technologiesmentioning
confidence: 99%
See 1 more Smart Citation
“…Most importantly, the resulting MRRs on the 6H-SiC Si-face and C-face surfaces were equal to 6.13 nm m −1 and 13.94 nm m −1 , respectively, indicating that C-face is indeed easier to remove than Si-face [ 5 ]. In 2022, Shi et al investigated the mechanical properties of different crystal orientations on a polished 4H-SiC wafer by using the nano-indentation and nano-scratching methods [ 6 ]. It was found that a larger elastic modulus leads to less material deformation, and therefore, a harder characteristic.…”
Section: Various Sic Cmp Technologiesmentioning
confidence: 99%
“…In contrast, the C-face surface showed elastic modulus and hardness equal to 476.7 GPa and 37.62 GPa, respectively, at the same penetration depth. Furthermore, the residue depth of indentation was 12.22 nm on the Si-face and 25.67 nm on the C-face, indicating more elastic recovery on the Si-face [ 6 ].…”
Section: Various Sic Cmp Technologiesmentioning
confidence: 99%
“…Silicon carbide (SiC) materials are believed to have revolutionized the power electronics industry [ 1 , 2 ]. Its properties, such as a wide bandgap, high-temperature stability and high thermal conductivity, will bring SiC-based power devices a series of advantages [ 2 , 3 , 4 ]. In recent years, as new energy vehicle enterprises have employed SiC-based MOSFET modules for high-end vehicles, the application prospect of SiC substrate materials has again attracted extensive attention.…”
Section: Introductionmentioning
confidence: 99%