Investigation of Surface Roughness for Grinding Silicon Wafer of the Micro Pellet Diamond Tool

Abstract

The purpose of this paper was to investigate the silicon wafer surface roughness ground by the micro pellet grinding tool and the electroplated disc grinding tool with diamond grit size of 4-6 μm and 10-20μm under the spindle rotation speed of 500-2500 rpm and the feed rate of 1-5 μm/min. The results showed that the micro pellet grinding tool can get a better surface roughness of the silicon wafer than the electroplated disc tool. When the tools containing a larger diamond grit were employed, selecting a higher spindle rotation speed and a lower feed rate can obtain a better wafer roughness. However, when the tools of a smaller diamond grit were used, the spindle rotaion speed operates properly at a optimal value to obtain a best wafer surface roughness, which achieves Ra = 0.03-0.06 μm for the micro pellet tool. Besides, the material removal mechanism during the grinding silicon wafer for these two tools displayed mainly ductile grinding behavior.