Investigation of surface integrity transition of SiCp/Al composites based on specific cutting energy during ultrasonic elliptical vibration assisted cutting

Zhou, Jiakang; Lu, Mingming; Lin, Jian; Zhou, Xiaoqin; Guo, Mingqi; Du, Yongsheng

doi:10.1016/j.jmapro.2022.04.067

Cited by 34 publications

(5 citation statements)

References 41 publications

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“…The AP value is the area under the P-R curve formed by connecting points consisting of precision and recall at different confidence levels. The values of precision, recall, AP, and mAP can be obtained from Equations ( 1)- (4).…”

Section: Training and Evaluation Of Defect Detection Model 231 Enviro...mentioning

confidence: 99%

“…In practice, the processing quality of materials is highly demanded in various areas of precision and ultra-precision production and manufacturing. However, the addition of silicon carbide particles, while giving SiCp/Al composites excellent properties, also weakens the machinability of SiCp/Al composites [4], resulting in poor machined surface quality and the presence of various defects [5,6]. Therefore, a reduction in machined surface defects and improvements in machined surface quality are important for the further development and application of SiCp/Al composites.…”

Section: Introductionmentioning

confidence: 99%

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Study of Surface Defect Detection Techniques in Grinding of SiCp/Al Composites

Wang,

Zhang,

Zhou

et al. 2023

Applied Sciences

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SiCp/Al composites are used in the aerospace, automotive, and electronics fields, among others, due to their excellent physical and mechanical properties. However, as they are hard-to-machine materials, poor surface quality has become a major limitation to their wider applications. To effectively control the quality of machined surfaces, it is necessary to accurately detect and characterize defects. Based on the YOLOv4 object detection algorithm, a SiCp/Al composite machined surface defect detection model has been developed for the accurate and fast detection of machined surface defects. OpenCV is used to process images of detected defects and extract defect feature parameters. The number of defects and the total defect area in the same machining area are used as evaluation criteria to assess the quality of the machined surface, and the effect of the machining parameters on the quality of the machined surface is analyzed. The results show that the number and total area of surface defects that occur when grinding SiCp/Al composites are positively correlated with the feed rate, tool diameter, and size of the abrasive, while they are negatively correlated with the spindle speed and ultrasonic vibration amplitude. When the grinding depth is greater than 20 microns, the quality of the machined surface is greatly affected.

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Section: Training and Evaluation Of Defect Detection Model 231 Enviro...mentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Study of Surface Defect Detection Techniques in Grinding of SiCp/Al Composites

Wang,

Zhang,

Zhou

et al. 2023

Applied Sciences

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“…At present, vibration-assisted machining has become increasingly prevalent in diverse fields of metal processing, including vibration-assisted cutting, vibration-assisted rolling, and vibration-assisted grinding [1][2][3][4][5][6][7]. Extensive studies have been conducted by many scholars, revealing that vibration-assisted machining can decrease the curve machining force and enhance surface accuracy and hardness [8][9][10][11][12][13].…”

Section: Introductionmentioning

confidence: 99%

Molecular dynamic simulation of the influence of vibration effects on scratching processes in Varied crystal orientations

Qiu-Yang,

Zhen-Yu,

et al. 2023

Modelling Simul. Mater. Sci. Eng.

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The research delves into the uncharted terrain of crystal orientation’s effect on high-frequency vibration-assisted processing of single-crystal copper, employing molecular dynamics to devise non-vibration, one-dimensional (1D), and two-dimensional (2D) vibration-assisted scratching models. The innovative discovery is the ‘peak-shaving’ effect, invoked by high-frequency vibration, which significantly mitigates surface irregularities on single-crystal copper, enhancing surface quality and material plasticity, thereby facilitating machinability. A key revelation is the superior efficacy of 2D vibration in material fortification relative to 1D vibration. Another novel finding is the amplified plasticity of single-crystal copper with a (111) crystal orientation under vibration-assisted excitation, linked to the varying directions of dislocation slip contingent upon crystal orientations. The pioneering observation that the induction of vibration during scratching dynamically propels dislocation defect structures, leading to the generation of a significant volume of vacant and interstitial atomic sites, underscores the pronounced influence of 2D vibration. This research contributes invaluable microscopic perspectives into the operative mechanism of crystal orientation’s impact on high-frequency vibration-assisted processing.

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“…Kadivar et al [25] investigated that the cutting force was significantly reduced under ultrasonic vibration-assisted drilling. Zhou and Lu et al [26,27] revealed that the tool wear markedly reduced during the ultrasonic vibration-assisted turning of SiCp/Al. Kang et al [28] found that the grinding force of ultrasonic vibration-assisted grinding of 55vol.% SiCp/Al is 35-50% lower than that of conventional grinding.…”

Section: Introductionmentioning

confidence: 99%

Modeling for Ultrasonic Vibration-assisted Helical Grinding of SiC particle-reinforced Al-MMCs

Li¹,

Yuan

Gao³

et al. 2023

Preprint

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Silicon carbide (SiC) particle-reinforced aluminum matrix (SiCp/Al) composites have continuously increased applications in abundant industries due to their superior mechanical properties. However, such composites have issues achieving desired machinability and quality standard due to the presence of SiC particles which is the main hindrance to their applications. In this paper, the methodology of ultrasonic vibration-assisted helical grinding (UVHG) of SiCp/Al composites has been applied to achieve to desired quality and efficiency for such composites. Then a mechanical cutting force model was developed to predict grinding forces. The grinding force was separated into friction force, plastic deformation force, and fracture force on account of the material removal mechanism. The undeformed chip thickness and cross-sectional area were calculated for the grinding force of a single diamond abrasive grit and then extended to the whole tool. By considering the acoustic softening effect of reduction of deformation stress caused by ultrasonic vibration, the acoustic softening coefficient was first proposed in the model to correct the impact of the ultrasonic vibration for properties of SiCp/Al composites. The experimental machining (UVHG) was carried out considering the different groups of experiments. The experimental results found agreed with the predicted values of cutting forces. The prediction deviation of the model was 7.06%, which could provide further guidance for the grinding process optimization of SiCp/Al composites. The novel cutting force predicted model and proposed machining methodology could be applied to machining SiCp/Al composites at the industry level and further research work.

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Investigation of surface integrity transition of SiCp/Al composites based on specific cutting energy during ultrasonic elliptical vibration assisted cutting

Cited by 34 publications

References 41 publications

Study of Surface Defect Detection Techniques in Grinding of SiCp/Al Composites

Study of Surface Defect Detection Techniques in Grinding of SiCp/Al Composites

Molecular dynamic simulation of the influence of vibration effects on scratching processes in Varied crystal orientations

Modeling for Ultrasonic Vibration-assisted Helical Grinding of SiC particle-reinforced Al-MMCs

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