Investigation of properties and curing process of silver paste electrically conductive adhesives (ECAs)

Li, Saipeng; He, Xinyue; Hao, Jian; Zhou, Jian; Xue, Feng

doi:10.1109/icept.2017.8046454

Cited by 2 publications

(2 citation statements)

References 10 publications

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“…5. With a targeted 10 MPa adhesion strength that are observed with epoxy-based silver adhesives [27], the stresses of 2-3 MPa are low enough to ensure no mechanical failures during bending. When analyzing the stress build-up by the applied displacement from 1 -15 mm, Fig.…”

Section: Embedded-chip Package Structure and Mechanical Modelingmentioning

confidence: 99%

Embedded-Component Planar Fan-Out Packaging for Biophotonic Applications

Hassan

Soroushiani

Abdal

et al. 2022

IEEE Open J. Nanotechnol.

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Embedded-chip planar silver-elastomer interconnect technology is developed with flexible substrates and demonstrated for on-skin biophotonic sensor applications. This approach has several benefits and is also consistent with chip-thinning where the chip thickness is 100 microns and less. The key benefits from this approach arise because both the bottom and top sides are now available as flat surfaces for 3D integration of other components. It also results in the lowest electrical parasitics compared to flipchip with adhesives or printed-ramp interconnections with surface-assembled devices. Embedding of chips in flexible carriers was accomplished with direct screen-printed interconnects onto the chip pads in substrate cavities. Silver nanoflake-loaded polyurethane is utilized in the embedded-chip packages to provide the desired lower interconnect resistance and also reliability in flexible packages under deformed configurations. Viscoelastic models were utilized to model the interconnection stresses. Planar interconnects in flexible substrates are developed with conductive silver-loaded elastomer interconnects. This approach is compared to direct chip-on-flex assembly technology for reliability under bending and high-temperature storage. The embedded-chip technology is demonstrated through biophotonic sensor applications where light sources (LEDs) and photodetectors are embedded inside the package. Functional validation in bent configuration at low curvatures is shown by measuring pulse rate and muscle activity with human subjects. By extending this technology to nanowires in elastomers, further enhancement in electrical and reliability performance can be achieved.

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Section: Embedded-chip Package Structure and Mechanical Modelingmentioning

confidence: 99%

Embedded-Component Planar Fan-Out Packaging for Biophotonic Applications

Hassan

Soroushiani

Abdal

et al. 2022

IEEE Open J. Nanotechnol.

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“…The sintering process can dry out the ink swiftly and remove the bubbles. 16 The sintering temperature needs to carefully chosen as over-sinter or under-sintering can break the printed lines and degrade the overall quality of printed devices.…”

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confidence: 99%

Investigation of Printing Properties on Paper Substrate

Saha

Knaus

Khosla

et al. 2018

J. Electrochem. Soc.

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In this article, the optimum printing parameters were found when using silver nanoparticle ink to print on Kodak 4-Star photo paper substrate. Fujifilm Dimatix 2831 was used as the inkjet printer. The printing parameters of interest included the number of printing layers, the drop spacing, and curing temperature of the ink. Analysis of Variance (ANOVA) analysis of the experimental data reveals sintering temperature to be significant (p < 0.05) to improve the conductivity. Pattern conductivity and surface roughness were used to identify the optimum printing parameters. The optimum printing parameters were found to be 15 μm drop spacing, two printing layer, and a sintering temperature of 90 • C. The best conductivity measured under the above mentioned condition was found to be 5.56 × 10 6 −1 m −1 . Further, the bending test indicated that the printed patterns were unaffected (in terms of conductivity) when flexed around a cylindrical support indicating excellent stability under stress. This study paves the way for developing mechanically robust flexible devices with excellent electrical properties for Internet of Things (IoT) applications.

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Investigation of properties and curing process of silver paste electrically conductive adhesives (ECAs)

Cited by 2 publications

References 10 publications

Embedded-Component Planar Fan-Out Packaging for Biophotonic Applications

Embedded-Component Planar Fan-Out Packaging for Biophotonic Applications

Investigation of Printing Properties on Paper Substrate

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