Investigation of phononic band gap structures considering interface effects

Zhu, Xingyi; Zhong, Sheng; Sun, Daquan; Ye, Anke; Deng, Fuwen

doi:10.1016/j.physb.2014.06.012

Cited by 11 publications

(2 citation statements)

References 29 publications

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“…In recent years, many researchers have studied the effects of the adhe sive layers between different materials on the forbidden band gaps [30,31]. Based on the boundary element method, Zhu et al [32] studied the band gap of inplane wave in 2D PCs considering interface effects. Actually, the adhesive layer is very sensitive to the temperature, but very rare articles investigated the thermal effects of the adhesive layers on the band gap structures.…”

Section: Introductionmentioning

confidence: 99%

Thermal tuning on band gaps of 2D phononic crystals considering adhesive layers

Zhou

Chen

et al. 2018

J. Phys. D: Appl. Phys.

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Phononic crystals are very attractive in many applications, such as noise reduction, filters and vibration isolation, due to their special forbidden band gap structures. In the present paper, the investigation of tunable band gaps of 2D phononic crystals with adhesive layers based on thermal changing is conducted. Based on the lumpedmass method, an analytical model of 2D phononic crystals with relatively thin adhesive layers is established, in which the inplane and outofplane modes are both in consideration. The adhesive material is sensitive to temperature so that the band structure can be tuned and controlled by temperature variation. As temperature increases from 20 °C-80 °C, the first band gap shifts to the frequency zone around 10 kHz, which is included by the audible frequency range. The results propose an important guideline for applications, such as noise suppression using the 2D phononic crystals.

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Section: Introductionmentioning

confidence: 99%

Thermal tuning on band gaps of 2D phononic crystals considering adhesive layers

Zhou

Chen

et al. 2018

J. Phys. D: Appl. Phys.

View full text Add to dashboard Cite

show abstract

“…Thermal stress and thermally induced vibration problems of beams, plates, shells and 3D structures have been regarded as classical and long-standing problems [1][2][3][4], and those present practical importance in high-speed aircrafts, reactor vessels, turbines, micro-electromechanical systems (MEMS), etc., since these applications are subjected to variable heating [5][6][7][8][9].…”

Section: Introductionmentioning

confidence: 99%