Investigation of pad deformation and conditioning during the CMP of silicon dioxide films

Achuthan, Krishnashree; Curry, John F.; Lacy, Michael G.; Campbell, Daniel; Babu, S. V.

doi:10.1007/bf02655587

Cited by 49 publications

(48 citation statements)

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“…Published experimental work found that in situ conditioning had better and more stable removal rates and performed significantly better in terms of transporting and mixing the polishing slurry [12][13][14]. As an abrasive process conditioning effects pad wear during polishing bringing about pad thinning with, the size, shape, density and exposure of the diamond being the governing factors in determining the effectiveness of the conditioning process [13,15,16]. Consequently, the amount of time that the conditioning disk spends at any point on the pad or the dwell time, will affect the wear of the pad at that point, thus affecting the wear profile of the pad [11,17,18].…”

Section: Conditioningmentioning

confidence: 99%

Polishing pad surface characterisation in chemical mechanical planarisation

McGrath

Davis

2004

Journal of Materials Processing Technology

115

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Section: Conditioningmentioning

confidence: 99%

Polishing pad surface characterisation in chemical mechanical planarisation

McGrath

Davis

2004

Journal of Materials Processing Technology

115

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“…Modeling has suggested that there exists a threshold in applied pressure below which there is no removal due to the particles rolling [25]. To have a stable removal rate, the pad needs to get roughened by conditioning [26]. For the Logitech PM4 machine, it is not possible to do any controlled pad conditioning.…”

Section: Resultsmentioning

confidence: 99%

Effect of process parameters on material removal rate in chemical mechanical polishing of Si(100)

Forsberg

2005

Microelectronic Engineering

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“…Optimum polishing has been found to be related to the mechanical properties of the bulk a well as the roughness of the surface. Achuthan et al (1996) and Ng et al (2005) conducted experiments on methods to roughen the pad surfaces by diamond abrading tools. Li et al (1995) observed that the dynamic shear modulus of a polyurethane pad decreased by two thirds of its dry value after 5 h of soaking in water.…”

Section: Padmentioning

confidence: 99%

Coatings for Biomedical Applications

Hauert¹,

Falub²,

Thorwarth³

et al. 2013

Encyclopedia of Tribology

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DefinitionCapillary force and surface wettability are related phenomena happening at the interfaces of solid, liquid, and air phases, and are highly dependent upon the interaction between liquids and solid surfaces. Scientific Fundamental Surface WettabilityWhen a liquid is in contact with a solid surface in air, in general, a droplet of the liquid will be formed. The shape of the droplet depends upon the interaction between the liquid and the solid surface. If the interaction is strong, i.e., the liquid "likes" the surface, the liquid drop will be "flat." On the contrary, if the interaction is weak, i.e., the liquid "hates" the surface, it will "bead up." Scientifically, such a property is described quantitatively by the concept of contact angle, which demonstrates the angle (y) at which the air-liquid and solid-liquid interfaces meet (see Fig. 1). Such a situation is the result of the force balance at the location where air, liquid, and solid phase meet, the socalled "three phase contact line." The interfacial tension of air-liquid, air-solid, and liquid-solid interface is denoted by g al , g as , and g ls , respectively. The force balance is described by the well-known Young's equation (Blake 1993; Butt et al. 2003; Isrealachvili 2003):This is a clear description of the interaction between the solid and liquid, as a smaller value of contact angle exhibits a larger difference between g as and g ls and, therefore, a much lower interfacial tension between the solid and liquid.The contact angle measurement is also an informative way to show the surface wettability of a liquid on a solid surface. If the interaction between the liquid and the solid surface is strong, a much lower interfacial energy results, and, as a result, the surface will be covered more by the liquid so that more area with higher air-solid interfacial energy is replaced by much lower interfacial energy of the liquid and solid. The result is that the liquid droplet is more spread out and has a lower value of contact angle. On the other hand, an unfavorable interaction between the liquid and solid surface generates a higher interfacial energy and, therefore, the system will maximize the area of the solid-air interface and minimize that of the interface between the liquid and solid surface. Consequently, the liquid forms a droplet with a small footprint on the surface and has a higher value of contact angle.

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Investigation of pad deformation and conditioning during the CMP of silicon dioxide films

Cited by 49 publications

References 0 publications

Polishing pad surface characterisation in chemical mechanical planarisation

Polishing pad surface characterisation in chemical mechanical planarisation

Effect of process parameters on material removal rate in chemical mechanical polishing of Si(100)

Coatings for Biomedical Applications

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