Investigation of microstructure, thermal properties, and mechanical performances of Ni-added Sn-5.0Sb-0.5Cu/Cu solder joints

Chantaramanee, Suchart; Sungkhaphaitoon, Phairote

doi:10.1016/j.microrel.2021.114421

Cited by 14 publications

(3 citation statements)

References 24 publications

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“…In the soldering process, molten solder reacts with the metallization, resulting in the formation of intermetallic compounds (IMCs) at the joint interfaces [8][9][10]. IMC formation is an indicator of successful joints, like the Cu 6 Sn 5 and Cu 3 Sn phase in Sn-based solder/Cu joints [11,12]. However, the faster growth of IMCs accompanying the formation of Kirkendall voids gives rise to critical reliability issues [13].…”

Section: Introductionmentioning

confidence: 99%

Comparative Study of the Impurity Effect on SnAgCu and SnZn Solder Joints with Electrodeposited Cu

Li,

Yen,

Chen

2024

Materials

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Sn-3Ag-0.5Cu (SAC305)- and Sn-9Zn-based alloys (Sn-Zn-X, X = Al, In) are lead-free solders used in the fabrication of solder joints with Cu metallization. Electroplating is a facile technology used to fabricate Cu metallization. However, the addition of functional additive molecules in the plating solution may result in impurity residues in the Cu electroplated layer, causing damage to the solder joints. This study investigates the impurity effect on solder joints constructed by joining various solder alloys to the Cu electroplated layers. Functional additives are formulated to fabricate high-impurity and low-impurity Cu electroplated samples. The as-joined solder joint samples are thermally aged at 120 °C and 170 °C to explore the interfacial reactions between solder alloys and Cu. The results show that the impurity effect on the interfacial reactions between SAC305 and Cu is significant. Voids are massively formed at the SAC305/Cu interface incorporated with a high impurity content, and the Cu6Sn5 intermetallic compound (IMC) grows at a faster rate. In contrast, the growth of the Cu5Zn8 IMC formed in the SnZn-based solder joints is not significantly influenced by the impurity content in the Cu electroplated layers. Voids are not observed in the SnZn-based solder joints regardless of the impurity content, indicative of an insignificant impurity effect. The discrepancy of the impurity effect is rationalized by the differences in the IMC formation and associated atomic interdiffusion in the SAC305- and SnZn-based solder joints.

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Section: Introductionmentioning

confidence: 99%

Comparative Study of the Impurity Effect on SnAgCu and SnZn Solder Joints with Electrodeposited Cu

Li,

Yen,

Chen

2024

Materials

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“…therefore, the improvement in the existing lead-free solder alloys was necessary as well as to keep pace with the current advancement in the electronic products. recent research has investigated on the addition of alloying elements in the solder alloys such as bismuth (Bi), phosphorus (P), gallium (Ga) and so on [8][9][10].the presence of these alloying elements has proven to improve the properties and performance of existing lead-free solder alloys [2,11].…”

Section: Introductionmentioning

confidence: 99%

A Short Review on the Influence of Antimony Addition to the Microstructure and Thermal Properties of Lead-Free Solder Alloy

Zaimi,

Salleh,

Al Bakri Abdullah

et al. 2023

Archives of Metallurgy and Materials

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A Short review on the influence of Antimony Addition to the microStructure And thermAl ProPertieS of leAd-free Solder Alloy for long time, Sn-Pb solder alloys have been used extensively as the main interconnection materials in the soldering. it is no doubt that Sn-Pb offers many advantages including good electrical conductivity, mechanical properties as well as low melting temperature. however, Pb is very toxic and Pb usage poses risk to human health and environments. owing to this, the usage of Pb in the electronic industry was banned and restricted by the legislation. these factors accelerate the efforts in finding suitable replacement for solder alloy and thus lead-free solder was introduced. the major problems associated with lead-free solder is the formation of large and brittle intermetallic compound which have given a rise to the reliability issues. Micro alloying with Sb seems to be advantageous in improving the properties of existing lead-free solder alloy. thus, this paper reviews the influence of Sb addition to the lead-free solder alloy in terms of microstructure formations and thermal properties.

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“…Several techniques have been developed to enhance the overall performance of the solders. One possible approach is to introduce new microalloying materials into the solder, such as Al, Zn, In, Ce, Ho and Bi, which can observably change the microstructure while causing changes in the properties (Chantaramanee and Sungkhaphaitoon, 2021; Amares et al , 2021; El-Daly and Hammad, 2012; Feng et al , 2021; Giuranno et al , 2016; Maslinda et al , 2015; Shalaby, 2022; Wang et al , 2021; Yang et al , 2020). Sb has been broadly used as an efficient alloy additive to improve the properties of solder alloys because of its excellent wettability, improvement of microstructure and thermal characteristics (Giuranno et al , 2016).…”

Section: Introductionmentioning

confidence: 99%

Effect of rotating magnetic field on the microstructure and properties of Sn-Ag-Sb lead-free solder alloys

Wang

Zhou

Liu

et al. 2022

SSMT

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Purpose The purpose of this paper is to study the microstructure and properties of Sn-3.5Ag and Sn-3.5Ag-0.5Sb lead-free solder alloys with and without a rotating magnetic field (RMF). Design/methodology/approach Optical microscopy, scanning electron microscopy and X-ray diffraction were used to analyze the effect of an RMF on the microstructure of the solders. Differential scanning calorimetry was used to study the influence of the RMF on the thermal characteristics of the solders. The mechanical properties of the alloys were determined by tensile measurements at different strain rates. Findings The ß-Sn grains and intermetallic compounds for the Sn-3.5Ag and Sn-3.5Ag-0.5Sb lead-free solder alloys were refined under an RMF, and the morphology of the ß-Sn grains changed from dendritic to equiaxed. The pasty range was significantly reduced under an RMF. The ultimate tensile strength (UTS) of Sn-3.5Ag improved under the RMF, whereas the UTS of Sn-3.5Ag-0.5Sb decreased slightly. The addition of Sb to the Sn-3.5Ag alloy significantly enhanced the UTS and elongation (El.%) of the samples. The UTS of the solder increased with increasing strain rate. Originality/value The results revealed that the application of RMF in the molten alloy had a significant effect on its microstructure and mechanical properties. The thermal characteristics of the Sn-3.5Ag and Sn-3.5Ag-0.5Sb solder alloys were improved under the RMF. This research is expected to fill a knowledge gap regarding the behaviour of Sn-Ag solder alloys under RMF.

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Investigation of microstructure, thermal properties, and mechanical performances of Ni-added Sn-5.0Sb-0.5Cu/Cu solder joints

Cited by 14 publications

References 24 publications

Comparative Study of the Impurity Effect on SnAgCu and SnZn Solder Joints with Electrodeposited Cu

Comparative Study of the Impurity Effect on SnAgCu and SnZn Solder Joints with Electrodeposited Cu

A Short Review on the Influence of Antimony Addition to the Microstructure and Thermal Properties of Lead-Free Solder Alloy

Effect of rotating magnetic field on the microstructure and properties of Sn-Ag-Sb lead-free solder alloys

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