2023
DOI: 10.1016/j.ceramint.2022.12.217
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Investigation of mechanism and surface morphology on the femtosecond laser ablation of silicon nitride under different auxiliary processing environments

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Cited by 9 publications
(5 citation statements)
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“…When the laser current was 200 A, the frequency was 50 Hz, and the pulse width was 0.6 ms, the groove depth was reduced by 30% and the groove width was increased by 21%. Yu et al [ 19 ] studied the femtosecond laser ablation of silicon nitride in different environments and analyzed the effects of water environments on surface size and morphology. They concluded that when using a low-temperature assisted laser for multi-layer laser ablation, water-constrained laser processing cannot produce significant ablation depths.…”
Section: Introductionmentioning
confidence: 99%
“…When the laser current was 200 A, the frequency was 50 Hz, and the pulse width was 0.6 ms, the groove depth was reduced by 30% and the groove width was increased by 21%. Yu et al [ 19 ] studied the femtosecond laser ablation of silicon nitride in different environments and analyzed the effects of water environments on surface size and morphology. They concluded that when using a low-temperature assisted laser for multi-layer laser ablation, water-constrained laser processing cannot produce significant ablation depths.…”
Section: Introductionmentioning
confidence: 99%
“…Among the findings, studies have shown that the depth of laser processing depends on several conditions, including the nature of the material itself and the medium used in the processing [12]. In previous studies, the main focus has been on aqueous environments [13][14][15], ethanol and aqueous environments [16], and liquid isopropanol environments [17], but there are also drawbacks such as excessively high heights that prevent processing or lower heights that exacerbate surface burning.…”
Section: Introductionmentioning
confidence: 99%
“…On the issue of heat accumulation, Yu et al [14] investigated the effect of the underwater environment on the laser ablation of SiC surfaces. It was found that underwater ablation would reduce heat accumulation.…”
Section: Introductionmentioning
confidence: 99%
“…S. vander Linden et al [11] found that in picosecond-pulsed underwater laser ablation of silicon, the volume of material removed per pulse was better than that in the air environment. Yu et al [12] found that liquid-phase laser ablation of silicon nitride can effectively inhibit oxidation, but it will reduce the rate of material removal, and with the increase of scanning speed, the surface roughness increases, and the depth of laser ablation decreases. Zhou et al [13] utilized water-assisted laser ablation in the different water layers and found that the liquid-phase ablation environment can get clearer micrographs and smaller heataffected zones, the liquid-phase environment makes the inner wall of the grooves clean and smooth, and the depth of the grooves decreases with the increase of the liquid-phase flow rate.…”
Section: Introductionmentioning
confidence: 99%