Investigation of intermetallic compounds (IMCs) in electrochemically stripped solder joints with SEM

Hurtony, Tamás; Bonyár, Attila; Gordon, Peter; Harsányi, Gábor

doi:10.1016/j.microrel.2011.12.035

Cited by 33 publications

(18 citation statements)

References 11 publications

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“…cross sectioning, provide only a restricted view on the structure of the solder joint. Our novel, recently published method of selective electrochemical etching [14][15] , reveals the intermetallic structure of bulk solder and opens a new perspective in solder joint research. Due to the high selectivity of etching, the fine structure of intermetallic compounds is only slightly changed, therefore the original solder structure is revealed.…”

Section: Introductionmentioning

confidence: 99%

Characterization of the microstructure of tin-silver lead free solder

Hurtony

Szakál

Almásy

et al. 2016

Journal of Alloys and Compounds

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Reliability and lifetime are the two most relevant design considerations in the production of safety critical assemblies. For example in a modern automobile dozens of electronic assemblies are integrated in which thousands of solder joints are mounting the electronic components to the printed circuit boards. There exists no standardised and universal observation method for characterising the fine microstructure of such solder joints. Previously we have developed a new method for the quantitative characterization of lead-free solder alloys and in present study the validity of the proposed method is demonstrated. Microstructure of Sn-3.5Ag lead free solder alloy was investigated by electrochemical impedance spectroscopy. Solder samples were solidified with different cooling rates in order to induce differences in the microstructure. Microstructure of the ingots was revealed by selective electrochemical etching. Electrochemical impedance spectra (EIS) were measured before and after the selective etching process. The complex impedance spectra contain information about microstructure of the solder alloys. Comparison and modelling of two EIS spectra allowed obtaining a characteristic parameter of surface structure of the etched specimens. The EIS measurements were complemented with small angle neutron scattering measurements and scanning electron microscopy, in order to correlate the EIS parameter with the magnitude of the interface of the β-Sn and Ag3Sn phases.

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Section: Introductionmentioning

confidence: 99%

Characterization of the microstructure of tin-silver lead free solder

Hurtony

Szakál

Almásy

et al. 2016

Journal of Alloys and Compounds

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“…For the identification of the corroded areas in the solder joints, a special electrochemical etching method [24] was applied. The crosssections of the solder joints were placed into an electrochemical cell as work electrodes in a standard three electrode measurement setup.…”

Section: Methodsmentioning

confidence: 99%

Effect of current load on corrosion induced tin whisker growth from SnAgCu solder alloys

2015

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The effect of current load was investigated on corrosion induced tin whisker growth from SnAgCu (SAC) solder alloys. Three alloys were studied: two low Ag content micro-alloyed SAC and the widely used SAC305. The solder joints were loaded with six different DC current levels between 0-1.5A and they were aged in corrosive environment (85°C/85RH%) for 3000h. The morphology of the whiskers and the micro-structural changes of the solder joints were examined by scanning electron microscope. It was shown that the current load can decrease the corrosion of the solder joints and consequentially it can decrease whiskering as well.

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“…3) [57]. By applying this technique, it was shown that the average surface between the tin-silver intermetallic compound (IMC) and the tin matrix is varying as the function of the quenching temperature of the solder samples.…”

Section: Micro-and Nano-scale Materials Characterizationmentioning

confidence: 99%

BME VIK Annual Research Report on Electrical Engineering and Computer Science 2016

Charaf

Harsányi

Poppe

et al. 2017

Period. Polytech. Elec. Eng. Comp. Sci.

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Preface Since being established in 1949, the Faculty of Electrical Engineering and Informatics (VIK) BME has played a flagship role in the development of electronics, IT and computer science in Hungary.We László Jakab (dean, BME VIK) János Levendovszky (vice-dean in charge of scientific affairs, BME VIK) are proud of combining engineering applications with sound scientific results, which is the assurance of high-level industrial collaboration leading to novel results and innovation. The various collaborations with our industrial partners has made it clear that the industry expects methods and results which make their industrial processes more effective and increase productivity and quality. Thus, participation in these collaborations give a competitive edge and ensure the continuous development of VIK. These factors have positioned our Department of Automation and Applied InformaticsDepartment of Automation and Applied Informatics (AUT) is one of the largest and dynamically developing departments at BME with diverse scope competences such as control theory, embedded systems, software modelling, applied software development, Internet of Things, power electronics, mechatronics, and many others. The department's main activities are education, research and development. Training versatile electrical and software engineers with solid practical knowledge is our top priority. Our profile also includes developing high quality software and hardware solutions for industry partners. All of our activities are backed by strong research background.In 2016, the department organized and hosted a number of domestic and international events. In cooperation with the industry, AUT has organized the IoT4U conference. It was dedicated to Internet of Things, cloud and data management as well as the integration of IoT into various formats. RobonAUT, the yearly domestic amateur robotics contest was organized by the department in February 2016. The yearly contest is open to teams of students, organized either in student projects within the department or independent research teams.The next sections summarize the key research results of the department in year 2016. Software Development Methods and Mobile PlatformsThe diversity of mobile platforms necessitates the development of the same mobile application for all major mobile platforms, what requires considerable development effort. Mobile application developers are multiplatform developers, but they still prioritize the platforms, therefore, not all platforms are equally important for them. Appropriate methods, processes and tools are required to support the development in order to achieve better productivity.The research on educational mobile applications that adapt to the mental state of the user required a method for estimating the difficulty of tasks found in the serious games. There are generated or random assignments where the effort required from the user is not known or cannot be estimated in advance.61 (2) IoT and Smart CityThe Internet of Things (IoT) is transforming the surroun...

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Investigation of intermetallic compounds (IMCs) in electrochemically stripped solder joints with SEM

Cited by 33 publications

References 11 publications

Characterization of the microstructure of tin-silver lead free solder

Characterization of the microstructure of tin-silver lead free solder

Effect of current load on corrosion induced tin whisker growth from SnAgCu solder alloys

BME VIK Annual Research Report on Electrical Engineering and Computer Science 2016

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