2018
DOI: 10.4172/2169-0022.1000482
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Investigation of Interface Diffusion in Sputter Deposited Gd0.1Ce0.9O1.95 Thin Buffer Layers on Y-Stabilized Zirconia Crystalline Substrates for Solid Oxide Cells Applications

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Cited by 2 publications
(3 citation statements)
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“…Here, we extend the results shown in Reference [14] to the case of GDC barrier layers sputter-deposited at room temperature on polycrystalline YSZ 35 mm in diameter, and annealed after the deposition up to 1000 • C. The X-ray Diffraction (XRD) analysis showed the achievement of the desired GDC phase and the electrochemical measurements have allowed optimizing the post deposition annealing procedure. The comparison of the final performances among the SOFCs with sputtered GDC layer and those with screen-printed GDC layer have shown highly better performances both on the high frequency and low frequency resistance properties of the cells with sputter-deposited GDC layers, allowing to link the structural and stoichiometric quality of the produced samples with the final electrochemical behavior.…”
Section: Introductionsupporting
confidence: 61%
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“…Here, we extend the results shown in Reference [14] to the case of GDC barrier layers sputter-deposited at room temperature on polycrystalline YSZ 35 mm in diameter, and annealed after the deposition up to 1000 • C. The X-ray Diffraction (XRD) analysis showed the achievement of the desired GDC phase and the electrochemical measurements have allowed optimizing the post deposition annealing procedure. The comparison of the final performances among the SOFCs with sputtered GDC layer and those with screen-printed GDC layer have shown highly better performances both on the high frequency and low frequency resistance properties of the cells with sputter-deposited GDC layers, allowing to link the structural and stoichiometric quality of the produced samples with the final electrochemical behavior.…”
Section: Introductionsupporting
confidence: 61%
“…Typical deposition parameters are 400 W power applied at 13 MHz and 2.2 mTorr process gas (Ar) pressure. Previous studies allow measuring the deposition rate and its reproducibility during the time; typical deposition rate is about 30 nm/min and remains the same during the target lifetime [14].…”
Section: Samples Preparationmentioning
confidence: 99%
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