Investigation of foamed cathode through-mask electrochemical micromachining developed for uniform texturing on metallic cylindrical surface

Ming, Pingmei; Zhao, Chenhao; Zhang, Xinmin; Li, Xinchao; Gan, Qintao; Liu, Yan

doi:10.1007/s00170-018-1755-x

Cited by 13 publications

(6 citation statements)

References 42 publications

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“…It was further discovered from Figure.14 that the minimum CV depth and CV diameter are 5.4% and 1.9%, respectively, when the appropriate combination of the applied voltage (8.5 V) and the moving speed (0.5 m/s) are used, showing a considerably narrower variation range of 43.7-51.3 μm in depth and 370.9-394.9 μm in diameter. To the best knowledge of the authors from the reported literature, the CV values obtained in our study are sufficiently small to reach the levels that were obtained from the standard photolithographic photoresist electrochemical machining process [20,21,28], and they are also smaller than those achieved with the first version foamed cathode TMEMM process [30].…”

Section: Effect Of the Applied Voltages And The Moving Speed Of The Mmentioning

confidence: 45%

“…In the foamed cathode TMEMM, a foamed metal film with a porosity of above 95% is introduced as both the cathode and the mass transfer media, and it directly contacts the reusable through-mask under an appropriate external pressure; thus, the foamed cathode, the through-mask, and the anode form a sandwich-typed assembly, as shown in Figure 1a. Our research [30] shows that the foamed cathode TMEMM is able to achieve better geometric consistency in the fabricated microstructures mainly due to the significantly uniform current distribution on the entire machining areas (as shown in Figure 1b) and the excellent mass transfer conditions within the interelectrode gap.This paper focuses on investigating the modification version of the foamed cathode TMEMM process which is enabled with optimized mass transfer conditions and facilitative fixture of the through-mask. Traditionally, as shown in Figure 1a, the mass transfer within the interelectrode gap during TMEMM is driven by a pump, and the outlet and inlet for the electrolyte circulation system are generally fixed, which means the flow path and flow velocity distribution inside the interelectrode gap are relatively changeless.…”

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confidence: 82%

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confidence: 82%

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Through-Mask Electrochemical Micromachining with Reciprocating Foamed Cathode

et al. 2020

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A through-mask electrochemical micromachining process with a foamed cathode (foamed-cathode through-mask electrochemical micromachining (TMEMM)) has recently been proposed involving micro-scale surface microstructures with a high geometric consistency that are fabricated on the curved-surface workpiece. In this paper, to make the foamed-cathode TMEMM process more cost-efficient in the applications, significant modifications are made to this process and an upgraded version of the foamed-cathode TMEMM process is developed. In this modified process, the sandwich-like unit (including the foamed cathode, mask, and workpiece) is closely assembled by the magnetic field force instead of the conventionally-used mechanical force and is kept moving up-and-down inside the electrolyte, avoiding the use of the traditional pump-driven circulation for the electrode process. Experiments are carried out to evaluate the machining effect of this modified TMEMM for fabricating micro-dimples. The research results verify that this modified TMEMM process can produce highly uniform micro-dimples whose minimum CV (coefficient of variation) values in depth and in diameter are 5.4% and 1.9%, respectively, with smooth surfaces of the minimum Ra being 0.21-0.35 µm. These values are smaller than those previously reported. This results in the positive effects on the mass transfer driven by magnetohydrodynamic convection induced by the magnetic field within the interelectrode and the foamed electrode.Micromachines 2020, 11, 188 2 of 14 is very tedious and expensive. In addition, the photoresist through-mask cannot be well formed on the curved surface; as a result, the traditional TMEMM process is somewhat limited in industrial applications. Consequently, effort has been made to facilitate the preparation of the through-mask by researchers. For instance, Landolt et al. and Chauvy et al. [13,14] employed patterned oxide film as the through-mask to texturize titanium. Asoh et al. [15] presented a novel TMEMM process to accomplish the formation of large-scale microstructures just by using the self-assembled polystyrene colloidal crystal particles as the through-mask. In an unusual way, Schönenberger et al. [16] and Costa et al. [17,18] bonded the through-mask to the cathode surface instead of the workpiece surface (anode) to carry out the micro-pattern transferring operation. Recently, further optimized the preparation of the through-mask of this kind of cathode-typed TMEMM by using the removable dry film through-mask, resulting in high cost-effectiveness.Unlike the conventional TMEMM processes using the bonded through-mask, a removable and reusable through-mask electrochemical machining process was exploited by Zhu et al. [22][23][24]. In this novel process, the mask is pressed mechanically against the workpiece, and thus, it can be reused repeatedly, showing a favorable operational convenience and cost-effective superiority. Additionally, in this novel process, Qu et al. [25][26][27][28] used polydimethylsiloxane (PDMS) film as the reusable mask d...

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Section: Effect Of the Applied Voltages And The Moving Speed Of The Mmentioning

confidence: 45%

mentioning

confidence: 82%

mentioning

confidence: 82%

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Through-Mask Electrochemical Micromachining with Reciprocating Foamed Cathode

et al. 2020

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“…1(a). For large-area micro pits array, the etching at the edge of the workpiece is usually more significant than that at the center due to the edge effect of the electric field [13,22]. The difference in etching amount causes a non-uniform distribution of the passivation film content.…”

Section: Working Principle Of the Pa-tmee Methodsmentioning

confidence: 99%

Investigation on particle assisted through-mask electrochemical etching of micro pits array

Du¹,

Yu²,

Zhai³

et al. 2022

Preprint

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Microstructures are applied in various fields to improve the friction and lubrication of mechanical components. Through-mask electrochemical etching (TMEE) has shown good feasibility in machining microstructures array. However, the machining precision of microstructures gradually decreases with increasing etching depth in TMEE. Localization and uniformity are essential indicators of machining precision in TMEE. Herein, particle assisted through-mask electrochemical etching (PA-TMEE) method was proposed to improve the localization and uniformity. Firstly, a coupled multi-physical field model, including gas-liquid two-phase flow, particle motion, and electrochemical processes, was established and adopted to predict the profiles of micro pits. Secondly, a comparison experiment between PA-TMEE and traditional TMEE was performed. The experimental results show that using PA-TMEE instead of TMEE resulted in improved localization and uniformity of the micro pits array. Then, the paper analyzed the effect of particle diameter and content on micro pits. When the particle diameter was 40 µm, and the particle content was 6 g/L, the maximum etching factor was 2.4. The minimum coefficient of variation of the diameter and depth of micro pits were 3.3% and 5.2%. Finally, The machining mechanism of PA-TMEE was analyzed by Scanning Electron Microscopy and Energy Dispersive Spectrometer.

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“…In order to evacuate bubbles and some insoluble electrolytic products as well as optimize the cathode structure of conventional SLEMM, Zhang et al [25] proposed a process scheme of the open reaction unit by using a porous cathode. Ming et al [26] analyzed and verified the electric field distribution characteristics of the above method and fabricated micro-dimples arrays of dimensional uniformity on the cylindrical workpiece surface. Stray corrosion is an unavoidable phenomenon in TMEMM.…”

Section: Instructionmentioning

confidence: 99%

Jet Electrochemical Micromachining of Micro-Grooves with Conductive-Masked Porous Cathode

et al. 2020

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Surface structures with micro-grooves have been reported to be an effective way for improving the performance of metallic components. Through-mask electrochemical micromachining (TMEMM) is a promising process for fabricating micro-grooves. Due to the isotropic nature of metal dissolution, the dissolution of a workpiece occurs both along the width and depth. Overcut is generated inevitably with increasing depth, which makes it difficult to enhance machining localization. In this paper, a method of electrochemical machining using a conductive masked porous cathode and jet electrolyte supply is proposed to generate micro-grooves with high machining localization. In this configuration, the conductive mask is directly attached to the workpiece, thereby replacing the traditional insulated mask. This helps in achieving a reduction in overcut and an improvement in machining localization. Moreover, a metallic nozzle is introduced to supply a jetted electrolyte in the machining region with enhanced mass transfer via a porous cathode. The simulation and experimental results indicate that as compared with an insulated mask, the use of a conductive mask weakens the electric field intensity on both sides of machining region, which is helpful to reduce overcut and enhance machining localization. The effect of electrolyte pressure is investigated for this process configuration, and it has been observed that high electrolyte pressure enhances the mass transfer and improves the machining quality. In addition, as the pulse duty cycle is decreased, the dimensional standard deviation and roughness of the fabricated micro-groove are improved. The results suggest the feasibility and reliability of the proposed method.

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Investigation of foamed cathode through-mask electrochemical micromachining developed for uniform texturing on metallic cylindrical surface

Cited by 13 publications

References 42 publications

Through-Mask Electrochemical Micromachining with Reciprocating Foamed Cathode

Through-Mask Electrochemical Micromachining with Reciprocating Foamed Cathode

Investigation on particle assisted through-mask electrochemical etching of micro pits array

Jet Electrochemical Micromachining of Micro-Grooves with Conductive-Masked Porous Cathode

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