Investigation of fluid flow and heat transfer in wavy micro-channels with alternating secondary branches

Chiam, Zhong Lin; Lee, Poh Seng; Singh, Pawan Kumar; Mou, Nasi

doi:10.1016/j.ijheatmasstransfer.2016.05.097

Cited by 104 publications

(55 citation statements)

References 32 publications

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“…Table provides details of the geometry and other parameters used in the experimental study of Chiam et al Numerical results obtained at various Reynolds for regular wavy MC are in reasonably good agreement with the experiments carried out in the previous studies by Chiam et al The percentage of error between the experimental and numerical results for Nusselt number and pressure drop is in the range of 21–24% and 4–14% respectively, with the same geometrical and operating conditions. The probable reason for the variation is attributed to heat flux value not being reported in Chiam et al This has been taken as 50 W/cm 2 in the current study. Still, it can very clearly be observed from Figure that the numerical results closely follow the trend of experimental results reported in Chiam et al…”

Section: Experimental Validationsupporting

confidence: 77%

“…It is the ratio of heat transfer performance to the pressure drop penalty. The performance factor as defined in Chiam et al for any given geometry (B) compared with a reference geometry (A) is given by

P_{fB} = \frac{\frac{{Nu}_{B}}{f_{B}}}{\frac{{italicNu}_{A}}{f_{A}}},

where,…”

Section: Data Reductionmentioning

confidence: 99%

“…In this paper, heat transfer and fluid flow characteristics of wavy MC with tangential branched secondary channels (TBSCs) are numerically investigated and compared with other designs, such as wavy MC and wavy MC with 45 0 branched secondary channels. The numerical model considered is validated with experimental results from Chiam et al for wavy MC. With proper validation, the numerical model is extended to wavy MC with 45 0 branched secondary channels and wavy MC with TBSCs.…”

Section: Introductionmentioning

confidence: 99%

“…They concluded that heat transfer performance of the wavy MC heat sink is much better than straight MC heat sink. Chiam et al numerically analyzed the heat transfer and fluid flow characteristics of wavy MCs by introducing secondary branched channels, at every crest and trough, which are at 45 o to the channel axis. They documented that for wavy MCs with secondary branched channels, higher heat transfer rate and lower pressure drop are noticed at lower Reynolds number (<100), but the penalty of pressure drop increased at higher Reynolds number (>100) compared with regular wavy MCs.…”

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Numerical investigation of heat transfer enhancement in wavy microchannel with tangential branched secondary channels

Kumar

Balasubramanian

Tiwari

et al. 2019

Asia-Pacific J Chem Eng

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Microchannel (MC) heat sinks have been extensively researched and used for thermal management. Wavy MC heat sinks and wavy MC with 45 o branched secondary channel heat sinks are shown in the literature to have superior heat transfer enhancement capabilities than straight MCs, with more pressure drop as penalty. To minimize the pressure drop, a new design is introduced in this paper by altering the wavy MC, with tangential branched secondary channels, at peaks and troughs of the wavy MC. Numerical investigation is carried out in the Reynolds number range of 100 to 300 with constant heat flux wall boundary condition. A simple parametric study on the secondary channel width is also carried out. Wavy MC with TBSC, having secondary channel width as half of the primary channel, is found to have the best combination of heat transfer and pressure drop performance, compared with wavy MC heat sinks and wavy MC with 45 o branched secondary channel heat sinks. The flow phenomenon that leads to such performance is carefully analyzed and discussed in detail in this paper.

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Section: Experimental Validationsupporting

confidence: 77%

P_{fB} = \frac{\frac{{Nu}_{B}}{f_{B}}}{\frac{{italicNu}_{A}}{f_{A}}},

where,…”

Section: Data Reductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Numerical investigation of heat transfer enhancement in wavy microchannel with tangential branched secondary channels

Kumar

Balasubramanian

Tiwari

et al. 2019

Asia-Pacific J Chem Eng

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“…on  in in TT (5) where  in represents the inlet boundary of the model. The temperature field boundary conditions for the outlet and walls in the channel layer are given by:…”

Section: Boundary Conditions Of Channel Layermentioning

confidence: 99%

Topology optimization of heat sinks for instantaneous chip cooling using a transient pseudo-3D thermofluid model

Zeng

Wang

Yang

et al. 2020

International Journal of Heat and Mass Transfer

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With the increasing power density of electronics components, the heat dissipation capacity of heat sinks gradually becomes a bottleneck. Many structural optimization methods, including topology optimization, have been widely used for heat sinks. Due to its high design freedom, topology optimization is suggested for the design of heat sinks using a transient pseudo-3D thermofluid model to acquire better instantaneous thermal performance. The pseudo-3D model is designed to reduce the computational cost and maintain an acceptable accuracy. The model relies on an artificial heat convection coefficient to couple two layers and establish the approximate relationship with the corresponding 3D model. In the model, a constant pressure drop and heat generation rate are treated. The material distribution is optimized to reduce the average temperature of the base plate at the prescribed terminal time. Furthermore, to reduce the intermediate density regions during the density-based topology optimization procedure, a detailed analysis of interpolation functions is made and the penalty factors are chosen on this basis. Finally, considering the engineering application of the model, a practical model with more powerful cooling medium and higher inlet pressure is built.The optimized design shows a better instantaneous thermal performance and provides 66.7% of the pumping power reduction compared with reference design.

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Influence of secondary flow channels on heat transfer and fluid flow characteristics in curved microchannel

Mamidi

Balasubramanian

Kupireddi

et al. 2022

Asia-Pacific J Chem Eng

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Microchannel-assisted cooling technologies have found extremely suitable for compact heat exchangers surpassing conventional fan-assisted heat sink solutions. Though extensive research was done on straight channels, research on curved microchannel is scant. In the present study, hydraulic flow characteristics and cooling performance of curved microchannel with secondary flow (CMCSF) with four different oblique angles are investigated numerically and compared with conventional curved microchannel (CCMC). A 3D conjugate heat transfer analysis is performed for four CMCSFs and CCMC using commercial software ANSYS Fluent with Reynolds number (Re) ranging between 125 and 325. A part of fluid from main channel is diverted into the secondary channels, leading to re-initialization of boundary layers. Also, this diverted flow that is fed into adjacent main channels consecutively results in better fluid mixing. Owing to these two phenomena, there is a huge enhancement in heat dissipation through the channel. The results revealed a Nusselt number increment of up to 80.12% for CMCSF in comparison with CCMC. Moreover, the average wall temperature was recorded lowest for CMCSF with oblique angle 30 , which is 8.83 C lower in comparison with CCMC for same Re. For the entire range of Re considered, the overall performance of all CMCSFs was found better than CCMC with maximum performance factor of 1.62 being achieved with secondary channel orientation of 24 .

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Investigation of fluid flow and heat transfer in wavy micro-channels with alternating secondary branches

Cited by 104 publications

References 32 publications

Numerical investigation of heat transfer enhancement in wavy microchannel with tangential branched secondary channels

Numerical investigation of heat transfer enhancement in wavy microchannel with tangential branched secondary channels

Topology optimization of heat sinks for instantaneous chip cooling using a transient pseudo-3D thermofluid model

Influence of secondary flow channels on heat transfer and fluid flow characteristics in curved microchannel

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