Investigation of different options of pre-applied CSP underfill for mechanical reliability enhancements in mobile phones

Biomedical sensor technologies on the platform of mobile phones

“…The combination of mobile phones and biomedical sensors also counts much, no matter what way biomedical sensors would connect with mobile phones. Whether electrically connected or embedded, mechanical reliability needs to be enhanced to realize the implementation of the combined systems [111]. Anyway, to achieve feasibility, reliability, stability, minimization, and low-cost for the assembly of mobile-phone-based biomedical systems, the support of electrical and mechanical technologies is always indispensable.…”

Analysis of edge and corner bonded PSvfBGA reliability under thermal cycling conditions by experimental and finite element methods

“…In order to protect and prolong the life of flip chip interconnects, the underfill was introduced and became an essential component especially for organic substrates (or chip carriers) [1][2][3][4][5][6]. Underfill was also used in ball grid array (BGA) packages at the board level in order to improve the reliability of the packages under mechanical shock, vibration, bend, torsion and shear loadings during assembly and shipment [7][8][9][10][11].…”

Effect of Unfilled Underfills on Drop Impact Reliability Performance of Area Array Packages

“…These encapsulants are typically epoxies filled with silica, to reduce the composition's CTE. The use of underfill encapsulants has proliferated to encapsulation of area array packages such as CSP's and BGA's [3][4][5][6]. The CTE of the organic interposer differs little from the CTE of the organic board, so underfill is not used to improve thermal cycle performance of their solder joints.…”