Investigation of delamination control in plastic package

Zhao, Shufeng; Pang, Xingshou

doi:10.1016/j.microrel.2009.01.001

Cited by 14 publications

(4 citation statements)

References 11 publications

(14 reference statements)

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“…Similar with the thermal expansion, the hygroscopic swelling is also in linear relationship with normalized moisture content (NNC) [3][4][5][6]10], so the calculation of hygro-stress can be performed with the aid of thermal stress module by changing the coefficient of thermal expansion with hygrostrain and by using the normalized moisture content (NNC) as temperature load. Since thermal stress already existed before moisture diffusion, a three-step simulation must be performed to comprehensively evaluate the stress field of FCPBGA, details of the three-step simulation are described as follows: 1.…”

Section: Simulation Of Hygro-thermo-mechanical Stressmentioning

confidence: 99%

“…However, plastic packaging materials tend to absorb moisture from surrounding environment, which often results in deterioration of mechanical property of plastic material [1] and adhesion strength at constituent interfaces [2]. Hygroscopic swelling in polymeric materials often gives rise to stress and delamination between molding compounds and IC chips due to swelling mismatch and vapor pressure [3][4][5]. It has also been reported that hygroscopic swelling of underfill is one of the reasons for under-bump metallization (UBM) opening in flip-chip [6].…”

Section: Introductionmentioning

confidence: 99%

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Investigation on Hygro-Thermo-Mechanical Stress of a Plastic Electronic Package

Lan

et al. 2014

J. mech.

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Plastic packaging materials tend to absorb moisture from ambient environment and get swollen, this may raise hygro-stress in plastic electronic package and redistribute the internal stress. In this paper, we reviewed the dramatic deformation of a plastic package (Flip Chip Plastic Ball Grid Array-FCPBGA) due to moisture absorption first, then hygro-thermo-mechanical stress of the plastic package and its evolution during a period of three months were investigated with finite element method, user development was performed for this investigation. The finite element model was verified with hygro-thermal deformation of the FCPBGA measured with a 3-D moiré interferometry system. Following findings were obtained: A. Thermal stress field was changed a lot due to moisture absorption; B. Thermal stress of chip was released to some extent, but peal stress up to 62.2MPa occurred to the solder bump, thus the danger of Under Bump Metal (UBM) opening increased.

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Section: Simulation Of Hygro-thermo-mechanical Stressmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Investigation on Hygro-Thermo-Mechanical Stress of a Plastic Electronic Package

Lan

et al. 2014

J. mech.

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“…The groove will slow down and even stop the flow of compound during molding; and this will reduce the mold fresh and resin bleed effectively. At the same time the plasma cleaning before bonding layer-2 wires will not only reduce the oxidations but also the contaminations [5] . …”

Section: Contamination On Interconnection Leadsmentioning

confidence: 99%

A new package structure with power stacked-die multi-row lead and process flow

Qiu¹,

Zong²,

Jiang³

2011

2011 International Symposium on Advanced Packaging Materials (APM)

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SIP (System in Package), enhanced power capability and high I/O count are three technological trends of semiconductor packaging. Power Stacked-die Multi-row Lead package could synthesize these three advanced features into one single package by utilizing the stacked-die structure, Al wires and multi-row leads. The manufacturing process flow consists of twice die bonding, wire bonding, molding and lead trimming and forming processes. This paper will also analyze the potential issues of manufacturing process and propose the corresponding solutions. BackgroundSIP is one technological trend of semiconductor packaging by assembling multi chips with different components that are sourced from different IC device suppliers then synthesized in the final board assembly flow, it could achieve lowest cost and maximum logistical benefits. The stacked-die structure is a typical SIP device.Enhanced power capability is another leading trend for semiconductor packaging. In order to achieve high power and electric ability, crossingdie Al (Aluminum) wire is applied to load high current widely. However, the stacked-die package isn't applicable for Al wire which is restricted by the die-to-die overlapping area.In addition, high I/O count is a main metrics for semiconductor packaging. It directly determines capacity and function of semiconductor device. This paper introduces a new structure which combines stacked-die structure, high power capability and high I/O count together.

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“…Epoxy molding compounds (EMCs) are the leading packaging material in plastic packages. Delamination between EMC and leadframe often causes popcoming due to the moisture absorption of EMC, resulting in the cracking of the whole package [2][3]. So delamination is the main factor reducing plastic package reliability.…”

mentioning

confidence: 99%

Sample preparation device for molding compound adhesion test

Lü

Zhang

et al. 2011

2011 12th International Conference on Electronic Packaging Technology and High Density Packaging

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Moisture ingression in plastic packages generally occurs through delaminated interfaces between different materials. So the adhesion strength between molding compound and substrate is crucial to the plastic package reliability. In the present work, a sample preparation device was designed for molding compound adhesion test. A series of experiments has been done with this device. The results showed that the data obtained with this device was stable. The data fluctuation was relatively small. The sample preparation device was effective in molding compound adhesion test. IntroductionStarting with the transistor, the package has functioned as both a carrier and as an enclosure. As a carrier it allows the device's functionality to be fully accessed and to be assembled and electrically interconnected to other devices. As an enclosure it provides protection from physical damage and a supportive and controlled operating environment for the device [1].According to the needs of the IC, the package has undergone many changes. Nowadays, plastic package occupies a major share of the market mainly due to the low cost and high efficiency. Epoxy molding compounds (EMCs) are the leading packaging material in plastic packages. Delamination between EMC and leadframe often causes popcoming due to the moisture absorption of EMC, resulting in the cracking of the whole package [2][3]. So delamination is the main factor reducing plastic package reliability. And the adhesion strength between EMC and leadframe is the crucial issue.A lot of efforts were made to evaluate the adhesion strength between molding compound and substrate. There are many types of molding compound adhesion test. These include the 90 0 or 180 0 peel test, leadframe pull-out test, double-lap shear test, button shear test, sandwich doublecantilever-beam test and three-point-bend test with an end pre-crack. Among these experimental methods, the leadframe pull-out test and button shear test are the most popular methods.For these two kinds of adhesion tests, there were no standard parameters of sample. And there were no unified device to prepare the sample. In the present work, a sample preparation device for button shear test was designed to simplify the sample preparation. This device could make the molding compound adhesion test easier.

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Investigation of delamination control in plastic package

Cited by 14 publications

References 11 publications

Investigation on Hygro-Thermo-Mechanical Stress of a Plastic Electronic Package

Investigation on Hygro-Thermo-Mechanical Stress of a Plastic Electronic Package

A new package structure with power stacked-die multi-row lead and process flow

Sample preparation device for molding compound adhesion test

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