Abstract:In this study we conducted thermal oxidation of Czochralski p-type <100> silicon wafers. The oxidation was carried out at temperatures in the range of 850-1000• C, in a gas mixture of N2:O2, in order to deposit a thin layer (10 nm) of thermal silicon dioxide (SiO2), generally used in the surface passivation of solar cells. The measurements of effective minority carriers lifetime τ eff using the quasi-steady-state photoconductance have shown degradation of different samples after oxidation process. The calculat… Show more
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