Investigation of Deformation Fluctuation of IGBT Chips Under Switching Conditions Using the Dynamic Field Reconstruction Method

Wang, Jiahao; Bai, Libing; Chen, Cong; Zhang, Jie; Zhou, Quan; Tian, Lulu; Luo, Jun; Huang, Wei; Cheng, Yuhua

doi:10.1109/tpel.2022.3214807

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Investigation of Deformation Fluctuation of IGBT Chips Under Switching Conditions Using the Dynamic Field Reconstruction Method

Cited by 4 publications

References 25 publications

In Situ Full-Field Deformation Characterization of Power Module and FEA Model Calibration Based on Stereo Digital Image Methodology

In Situ Full-Field Deformation Characterization of Power Module and FEA Model Calibration Based on Stereo Digital Image Methodology

Dynamic Deformation Oriented Thermo-Mechanical Performance Assessment for Automotive Power Module With Various PWM Schemes

Lifetime Prediction for Lift-off of Bond Wires in IGBTs Using Paris Law With Analytical Calculation of Crack Length

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