Investigation of Cu coatings deposited by kinetic metallization

Han, York; Birbilis, Nick; Spencer, K.; Zhang, Mingxing; Muddle, Barrington Charles

doi:10.1016/j.matchar.2010.07.011

Cited by 15 publications

(8 citation statements)

References 14 publications

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“…Recent research works were carried out on the development of Cold spraying (CS) process which includes the processes, technology and the principles it involves as well as the potential applications [20][21][22]. CS technology has some variations which have been introduced to aid its capabilities.…”

Section: Conceptualization Of Cold Sprayingmentioning

confidence: 99%

“…Kinetic metallization (KM), a solid-state process is the first method introduced. This method uses a converging nozzle under a choked flow condition to achieve an exit gas velocity of Mach 1 by making the nozzle slightly divergent to minimize friction [22]. Other cold spraying methods used a De Laval nozzle to attain a supersonic speed of the propellant gas.…”

Section: Conceptualization Of Cold Sprayingmentioning

confidence: 99%

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A comparative review on cold gas dynamic spraying processes and technologies

Oyinbo

Jen

2019

Manufacturing Rev.

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Cold gas dynamic spraying (CGDS) is a relatively new technology of cold spraying techniques that uses converging-diverging (De Laval) nozzle at a supersonic velocity to accelerate different solid powders towards a substrate where it plastically deforms on the substrate. This deformation results in adhesion to the surface. Several materials with viable deposition capability have been processed through cold spraying, including metals, ceramics, composite materials, and polymers, thereby creating a wide range of opportunities towards harnessing various properties. CGDS is one of the innovative cold spraying processes with fast-growing scientific interests and industrial applications in the field of aerospace, automotive and biotechnology, over the past years. Cold gas spraying with a wide range of materials offers corrosion protection and results in increases in mechanical durability and wear resistance. It creates components with different thermal and electrical conductivities than that substrates would yield, or produces coatings on the substrate components as thermal insulators and high fatigue-strength coatings, and for clearance control, restoration and repairing, or prostheses with improved wear, and produces components with attractive appearances. This review extensively exploits the latest developments in the experimental analysis of CGDS processes. Cold gas dynamic spraying system, coating formation and deposit development, description of process parameter and principles, are summarized. Industrial applications and prospectives of CGDS in future research are also commented.

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Section: Conceptualization Of Cold Sprayingmentioning

confidence: 99%

Section: Conceptualization Of Cold Sprayingmentioning

confidence: 99%

A comparative review on cold gas dynamic spraying processes and technologies

Oyinbo

Jen

2019

Manufacturing Rev.

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“…The metal powder particles are heated to a temperature below the melting point and collided against a substrate at high velocity of several hundred meters per second or more to form a deposition layer owing to the kinetic energy of the particles. 14) Since this process is believed to be a solid-state process, various dissimilar combinations of powder particles and substrates can be selected, such as Ti particles/Al substrate, 5) Cu particles/Al substrate, 6) Al particles/Cu substrate, or Al particles/stainless steel substrate. 7) In addition, recently, not only metallic powders but also ceramic powders have been deposited via cold spraying.…”

Section: Introductionmentioning

confidence: 99%

“…13) In terms of the bonding mechanism between the deposition layer and substrates, interdiffusion on the order of ³1 µm or less occurred across the Cu/Al interface. 14) Al is often used in electric devices because of its superior electric and thermal conductivities. Since it is difficult to solder to Al, Ni or NiP plating, which is a wet coating process, is usually applied to Al surfaces to improve its solderability in the field of electronics packaging.…”

Section: Introductionmentioning

confidence: 99%

Characteristics and Microstructural Development of Cold-Sprayed Copper Coating on Aluminum

et al. 2019

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The cold spray method is a coating process that should improve the wettability of solder to aluminum surfaces. In this study, Cu powder particles were deposited on commercially pure Al via cold spraying, and the characteristics and microstructural developments of the deposited layer, interface, and substrate were investigated. Cu coatings, with an electronic resistivity similar to that of commercial solder, could be formed on the Al substrate. Solid-state bonding was partially achieved between the Cu particles. Interdiffusion occurred at the interface between the cold sprayed Cu particles and the Al substrate, forming the reaction phases, and the Cu coating was bonded to Al substrate along almost the entire bond interface. The impact of high-velocity particles induced dynamic recrystallization and grain refinement of Al, resulting in increased hardness near the surface of the Al substrate. The thickness of the hardened region was ³10 µm. Tin-based solder paste exhibited good wettability to the cold-sprayed Cu coating.

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“…HPCS and LPCS both have their advantages and disadvantages, but neither can fully satisfy industry needs. Kinetic metallization (KM) is a cold spray variant which exploits a frictioncompensated sonic nozzle that can reduces the consumption of accelerant gas [21].…”

Section: Review Of Cold Spray Systemsmentioning

confidence: 99%

Characterization of microstructural evolution and bond formation in cold sprayed aluminum alloy splats and substrates

Dan¹

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Cold spray is an emerging coating process in which feedstock powder particles, accelerated in a gas stream to velocities up to 1200 m/s, are deposited on a substrate to form a coating at temperatures far below the melting point of the powder or the substrate. Although cold spray has been widely studied and even commercialized in the recent decades, the bonding mechanism at the splat-substrate and splat-splat interfaces is still not clearly understood. We conducted extensive electron microscopic studies on splats of Al6061 and Al2024 cold spray-deposited on a T6-Al6061 substrate at a super-critical velocity to characterize the microstructural evolution in the impacting powder particle and the substrate and understand the occurrence of metallurgical bonding at the splat-substrate interface in relation to the structural changes. It was confirmed that metallurgical bonding at the splat-substrate interface is possible only when oxide-free mating occurs between the splat and the substrate. Oxide-free surfaces are created by the sweeping action of localized material flow along the interface that is promoted by rapid dynamic recovery and recrystallization in the materials along the interface. Material flow along the interface occurs more readily toward the splat peripheries than at the polar region of the splatsubstrate interface where normal stresses dominate. Improved bonding may be achieved with heat treated (softened) powder particles that would deform more uniformly along the splat-substrate interface. With a feedstock Al6061 powder pre-heat treated (softened) to 69 HV, the range of metallurgical bonding was extended toward the polar region. However, with much harder (142 HV) as-received feedstock Al2024 powder, no metallurgical bonding was observed at the polar or equatorial interface. Nano-scale precipitation IV observed in the vicinity of the Al6061 splat-Al6061 substrate interface indicates a high excess vacancy concentration during the impact, which could also explain the occurrence of rapid dynamic recovery and recrystallization in the material along the interfacial. V

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Investigation of Cu coatings deposited by kinetic metallization

Cited by 15 publications

References 14 publications

A comparative review on cold gas dynamic spraying processes and technologies

A comparative review on cold gas dynamic spraying processes and technologies

Characteristics and Microstructural Development of Cold-Sprayed Copper Coating on Aluminum

Characterization of microstructural evolution and bond formation in cold sprayed aluminum alloy splats and substrates

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