Investigation of Copper and Glass Interaction in Through Glass Via (TGV) During Thermal Cycling

Pan, Ke; Xu, Jiefeng; Lai, Yangyang; Park, Seungbae; Okoro, Chukwudi; Joshi, Dhananjay; Pollard, Scott

doi:10.1109/ectc32696.2021.00263

Cited by 18 publications

(4 citation statements)

References 15 publications

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“…Thin and small features such as C4, thermal interface material (TIM), and through silicon via make it impractical to use detailed models of microelectronic packages in board-level simulation (Pan et al , 2021; Yang et al , 2021). The compact model approach based on thermophysical property simplifications is used to eliminate these small features (Lasance, 2008).…”

Section: Computational Fluid Dynamics Model and Validationmentioning

confidence: 99%

An intelligent system for reflow oven temperature settings based on hybrid physics-machine learning model

Lai

Pan

Cen

et al. 2022

SSMT

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Purpose This paper aims to provide the proper preset temperatures of the convection reflow oven when reflowing a printed circuit board (PCB) assembly with varied sizes of components simultaneously. Design/methodology/approach In this study, computational fluid dynamics modeling is used to simulate the reflow soldering process. The training data provided to the machine learning (ML) model is generated from a programmed system based on the physics model. Support vector regression and an artificial neural network are used to validate the accuracy of ML models. Findings Integrated physical and ML models synergistically can accurately predict reflow profiles of solder joints and alleviate the expense of repeated trials. Using this system, the reflow oven temperature settings to achieve the desired reflow profile can be obtained at substantially reduced computation cost. Practical implications The prediction of the reflow profile subjected to varied temperature settings of the reflow oven is beneficial to process engineers when reflowing bulky components. The study of reflowing a new PCB assembly can be started at the early stage of board design with no need for a physical profiling board prototype. Originality/value This study provides a smart solution to determine the optimal preset temperatures of the reflow oven, which is usually relied on experience. The hybrid physics–ML model providing accurate prediction with the significantly reduced expense is used in this application for the first time.

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Section: Computational Fluid Dynamics Model and Validationmentioning

confidence: 99%

An intelligent system for reflow oven temperature settings based on hybrid physics-machine learning model

Lai

Pan

Cen

et al. 2022

SSMT

Self Cite

View full text Add to dashboard Cite

show abstract

“…In addition, the failure mechanism and optimization rule of TGV interposer architecture were systemically investigated [ 11 , 12 , 13 , 14 , 15 , 16 , 17 , 18 , 19 ]. Tensile radial and circumferential stresses were attributed to the origin of the circumferential cracks and the formation of radial cracks, respectively [ 11 , 13 , 14 ].…”

Section: Introductionmentioning

confidence: 99%

“…Tensile radial and circumferential stresses were attributed to the origin of the circumferential cracks and the formation of radial cracks, respectively [11,13,14]. Different annealing procedures were designed to study their influence on Cu protrusion mechanisms [12,15], and Cu protrusion was observed to saturate after a dwell time of 4 h with an annealing temperature of 400 • C. Irreversible Cu protrusion of Cu-filled TGV was generated after thermal cycling loading and is attributed to the plastic deformation and creep mechanism of Cu [16]. Different layout designs, such as fully filled via and conformal via, were demonstrated and investigated in terms of their thermomechanical reliability [17].…”

Section: Introductionmentioning

confidence: 99%

Layout Dependence Stress Investigation in through Glass via Interposer Architecture Using a Submodeling Simulation Technique and a Factorial Design Approach

et al. 2023

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The multi-chiplet technique is expected to be a promising solution to achieve high-density system integration with low power consumption and high usage ratio. This technique can be integrated with a glass interposer to accomplish a competitive low fabrication cost compared with the silicon-based interposer architecture. In this study, process-oriented stress simulation is performed by the element activation and deactivation technique in finite element analysis architecture. The submodeling technique is also utilized to mostly conquer the scale mismatch and difficulty in mesh gridding design. It is also used to analyze the thermomechanical responses of glass interposers with chiplet arrangements and capped epoxy molding compounds (EMC) during curing. A three-factor, three-level full factorial design is applied using the analysis of variance method to explore the significance of various structural design parameters for stress generation. Analytic results reveal that the maximum first principal stresses of 130.75 and 17.18 MPa are introduced on the sidewall of Cu-filled via and the bottom of the glass interposer, respectively. Moreover, the EMC thickness and through glass via pitch are the dominant factors in the adopted vehicle. They significantly influence the stress magnitude during heating and cooling.

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“…A specific failure of radial and circumferential cracks has been separately observed and attributed to the stress buildup during the heating and cooling process in the annealing heat treatment procedure [ 12 , 13 ]. The critical stress location of Cu-filled TGV has been explored as a Cu/glass interface because the mismatching of the aforementioned material CTE, the slower ramp rate, and the decent dwell time can help manage the thermal stress [ 14 , 15 ]. To reduce Cu protrusion-induced stress, a conformal-type TGV has been demonstrated, and a fully-filled TGV with considerable copper protrusion during thermal cycling was revealed [ 16 ].…”

Section: Introductionmentioning

confidence: 99%

Reliability Assessment of Thermocompressed Epoxy Molding Compound through Glass via Interposer Architecture by the Submodeling Simulation Approach

et al. 2022

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In glass interposer architecture and its assembly process, the mechanical responses of interposer structure under thermocompression process-induced thermal loading and generated shrinkage of molding material are regarded as a major reliability issue. Thousands of metal-filled via are involved in glass interposers and are regarded as a potential risk that can lead to cracking and the failure of an entire vehicle. In this study, a finite element-based submodeling approach is demonstrated to overcome the complexity of modeling and the relevant convergence issue of interposer architecture. Convergence analysis results revealed that at least four via pitch-wide regions of a local simulation model were needed to obtain the stable results enabled by the submodeling simulation approach. The stress-generation mechanism during thermocompression, the coefficient of thermal expansion mismatch, and the curing process-induced shrinkage were separately investigated. The critical stress location was explored as the outer corner of the chip, and the maximum first principal stress during the thermocompression process generated on the chip and glass interposer were 34 and 120 MPa, respectively.

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Investigation of Copper and Glass Interaction in Through Glass Via (TGV) During Thermal Cycling

Cited by 18 publications

References 15 publications

An intelligent system for reflow oven temperature settings based on hybrid physics-machine learning model

An intelligent system for reflow oven temperature settings based on hybrid physics-machine learning model

Layout Dependence Stress Investigation in through Glass via Interposer Architecture Using a Submodeling Simulation Technique and a Factorial Design Approach

Reliability Assessment of Thermocompressed Epoxy Molding Compound through Glass via Interposer Architecture by the Submodeling Simulation Approach

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