Investigation of Annealing Temperature on Copper Oxide Thin Films Using Sol-Gel Spin Coating Technique

Hashim, Hashimah; Samat, Suhana; Shariffudin, Shafinaz Sobihana; Saad, Puteri Sarah Mohamad

doi:10.1088/1757-899x/340/1/012008

Cited by 3 publications

(1 citation statement)

References 7 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The rise in the contact angle of the two liquids as the annealing temperature rises is explained by the fact that the annealing temperature produces a change of the CuO surface, resulting in a decrease in the hydrophilic properties of the films (adhesive properties). A shift in interfacial tension has been postulated to explain CuO's hydrophobicity [13]. Indeed, increasing the annealing temperature reduces active neutral species that react with the sample's surface and cause wettability [14].…”

Section: Wettability Analysis: Contact Angle Adhesion Work and Surfac...mentioning

confidence: 99%

Hydrophobic Properties of CuO Thin Films Obtained by Sol-Gel Spin Coating Technique-Annealing Temperature Effect

Bougharouat¹,

Touka²,

Talbi³

et al. 2021

ACSM

View full text Add to dashboard Cite

The adhesive characteristics of sol-gel copper oxide (CuO) film surfaces at annealing temperatures ranging from 350 to 550°C were examined in this work. Hydrophobic properties of these oxide film surfaces were studied by contact angle measurements. The surface energy was calculated from contact angle data using harmonic mean method. The structural, morphological and chemical analysis of the samples were characterized by X-ray diffraction (XRD), scanning electron microscopy (SEM) and Fourier transform infrared (FTIR). The increase in annealing temperature induces a reduction in the hydrophilic properties of the films (adhesive properties). The rise in the hydrophobicity of the CuO surface has been claimed to be explained by a change in interfacial tension. The FTIR spectroscopy analysis revealed that the increase in the annealing temperature eliminates activated neutral species (hydroxyl groups) reacting with the surface of the sample responsible for the wettability. SEM analysis showed that the morphology of the samples is nanostructured containing agglomerates of various forms, a few hundred nanometers in size, randomly dispersed across the surface. The enhanced roughness of the produced film is primarily responsible for the increased hydrophobicity of the films. The XRD data reveal that the films are highly textured and that increasing the annealing temperature induces better layer crystallization and confirms the development of copper oxide CuO.

show abstract

Section: Wettability Analysis: Contact Angle Adhesion Work and Surfac...mentioning

confidence: 99%

Hydrophobic Properties of CuO Thin Films Obtained by Sol-Gel Spin Coating Technique-Annealing Temperature Effect

Bougharouat¹,

Touka²,

Talbi³

et al. 2021

ACSM

View full text Add to dashboard Cite

show abstract

A numerical simulation of solar cells based on the CuO and Cu2O absorber layers with ZnMgO window layer

Ivashchenko,

Diachenko,

Opanasyuk

et al. 2024

Materials Science and Engineering: B

View full text Add to dashboard Cite

Effect of Rapid Thermal Annealing on CuO Nanoparticles

Boumezrag,

Almi,

Lakel

et al. 2024

Annals of West University of Timisoara - Physics

View full text Add to dashboard Cite

This work is a comparative study of the effect of two different annealing methods on copper oxide (CuO) nanoparticle properties obtained previously by direct precipitation method. The prepared samples were annealed in air at various temperatures (300, 400, 500°C) for 1 hour. Then they were characterized by employing scanning electron microscopy (SEM), X-ray diffraction (XRD), UV-Visible, and Fourier Transform Infrared (FT-IR) spectroscopy. The main results revealed an increase in the grain size in both methods as the annealing temperature increases. It reaches 30.93 nm in RTA and 26.75 nm in STA at 500°C. XRD spectra showed, in the case of RTA at 500 °C, a significant decrease in the intensity corresponding to the (002) and (111) orientations. This result indicated that beyond 400 °C, one hour of RTA is not suitable for enhancing CuO nanoparticle crystallinity compared to STA. The optical analysis demonstrated that the energy of the optical band gap in STA is higher than that in RTA. It reaches 2,88 eV at 500°C using RTA which is close to the gap value of CuO in the range of 1.8–2.8 eV. FT-IR results showed, for both methods, the presence of characteristic peaks of the Cu-O bonds in the monoclinic CuO structure without any trace of Cu2O structure. Nevertheless, samples exposed to RTA for one hour are more susceptible to absorbing species of C=O bond (C=O bond is due to the atmospheric CO2 absorption and the presence of organic impurities from the synthesis process) than those of STA. Hence, RTA at 500 °C is far from producing CuO nanoparticles with preferred characteristics; it needs further research to examine the effect of higher temperature by controlling the annealing time.

show abstract

Investigation of Annealing Temperature on Copper Oxide Thin Films Using Sol-Gel Spin Coating Technique

Cited by 3 publications

References 7 publications

Hydrophobic Properties of CuO Thin Films Obtained by Sol-Gel Spin Coating Technique-Annealing Temperature Effect

Hydrophobic Properties of CuO Thin Films Obtained by Sol-Gel Spin Coating Technique-Annealing Temperature Effect

A numerical simulation of solar cells based on the CuO and Cu2O absorber layers with ZnMgO window layer

Effect of Rapid Thermal Annealing on CuO Nanoparticles

Contact Info

Product

Resources

About