2019
DOI: 10.1063/1.5098489
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Investigation of Al2O3/GaN interface properties by sub-bandgap photo-assisted capacitance-voltage technique

Abstract: Interfaces in Al2O3/n-GaN capacitors fabricated on free-standing GaN substrates were investigated using sub-bandgap photo-assisted capacitance-voltage measurements. After post-metallization annealing (PMA) at 300 °C, the metal-oxide-semiconductor (MOS) devices exhibited excellent capacitance-voltage (C-V) characteristics without frequency dispersion under dark conditions and a quite low interface state density (Dit) of ∼7×1010 cm-2 eV-1 for energies less than ∼1.2 eV from the conduction band edge. Despite the … Show more

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Cited by 18 publications
(8 citation statements)
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“…Furthermore, the interface state between p-SnO and (Al)GaN is another factor affecting the device performance. According to the reports of (Al)GaN MOS-HEMT, the polarity, energy level positions, and concentrations of interface traps may cause the instability of V th [40,41]. Therefore, we assumed two defect levels (E 1 = E c − 0.5 eV, E 2 = E v + 0.5 eV) and two defect densities (1 × 10 13 and 1 × 10 11 cm −2 ) at the p-SnO/AlGaN interface.…”
Section: Th Stability Of P-sno Gate Cap Hemtmentioning
confidence: 99%
“…Furthermore, the interface state between p-SnO and (Al)GaN is another factor affecting the device performance. According to the reports of (Al)GaN MOS-HEMT, the polarity, energy level positions, and concentrations of interface traps may cause the instability of V th [40,41]. Therefore, we assumed two defect levels (E 1 = E c − 0.5 eV, E 2 = E v + 0.5 eV) and two defect densities (1 × 10 13 and 1 × 10 11 cm −2 ) at the p-SnO/AlGaN interface.…”
Section: Th Stability Of P-sno Gate Cap Hemtmentioning
confidence: 99%
“…Physical vapor deposition (PVD) is successfully used for the growth of the aluminum oxide 39–41 on other substrates, and it seems like an interesting choice for an alternative to ALD‐Al 2 O 3 . Al 2 O 3 /n‐GaN system is widely studied by many groups, 3,42–48 mostly focusing on near interface trap density and electrical properties. So far, a few reports have been published on the properties of the Al 2 O 3 /n‐GaN interface formed by ALD 12,18,49 but none by PVD.…”
Section: Introductionmentioning
confidence: 99%
“…So far, traps in Al 2 O 3 /GaN MOS structures have been extensively studied using the photo-assisted C-V method. [24][25][26] An earlier study indicated that a low average interface state density (D it ) of 7 × 10 10 cm −2 eV −1 can be achieved within the entire bandgap of GaN through postmetallization annealing (PMA) of Al 2 O 3 /GaN structures at 800 °C in nitrogen (N 2 ) gas. 24) However, at this temperature condition, grain boundaries form in the Al 2 O 3 layer due to its partial crystallization, leading to a high gate leakage current.…”
mentioning
confidence: 99%
“…17) With a reduced PMA temperature of 300 °C, D it values as low as 7 × 10 10 cm −2 eV −1 were successfully achieved for energies less than 1.2 eV from the conduction band edge (E C ), while higher D it values of (2-4) ×10 12 cm −2 eV −1 were detected near the valence band edge (E V ). 25) Despite these important findings in Al 2 O 3 /GaN structures, reports on SiO 2 /GaN structures remain limited. To gain insight into the hole traps in SiO 2 /GaN systems, systematic photo-assisted C-V measurements should be conducted on a set of samples processed under various conditions.…”
mentioning
confidence: 99%
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