2022
DOI: 10.1016/j.optlaseng.2021.106787
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Investigation of a fitting phase-shift method for stress analysis using infrared photoelasticity

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Cited by 10 publications
(4 citation statements)
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“…Residual stress is an important factor of optical components that has a significant impact on their usage 41 . As a non-destructive measurement method to detect the strain in the optical components, the optical strain measurement based on the photoelasticity has widely been applied in the industry of glass manufacturing and photovoltaic panel manufacturing 42 . Here, taking the advantages of our polarization-sensitive IR photodetectors with ultrahigh polarization sensitivity, we apply it into the optical strain measurement system to evaluate the strain in a polystyrene (PS) film.…”
Section: Resultsmentioning
confidence: 99%
“…Residual stress is an important factor of optical components that has a significant impact on their usage 41 . As a non-destructive measurement method to detect the strain in the optical components, the optical strain measurement based on the photoelasticity has widely been applied in the industry of glass manufacturing and photovoltaic panel manufacturing 42 . Here, taking the advantages of our polarization-sensitive IR photodetectors with ultrahigh polarization sensitivity, we apply it into the optical strain measurement system to evaluate the strain in a polystyrene (PS) film.…”
Section: Resultsmentioning
confidence: 99%
“…Residual stress is an important factor of optical components that has a signi cant impact on their usage 40 . As a non-destructive measurement method to detect the strain in the optical components, the optical strain measurement based on the photoelasticity has widely been applied in the industry of glass manufacturing and photovoltaic panel manufacturing 41 . Here, taking advantages of our polarization-sensitive IR photodetectors with ultrahigh polarization sensitivity, we apply it into the optical strain measurement system to evaluate the strain in a polystyrene (PS) lm.…”
Section: Application Demonstrations In Polarization Coded Communicati...mentioning
confidence: 99%
“…Various techniques, such as shadow moiré interferometry, Twyman-Green interferometry, X-ray radiography, scanning acoustic microscopy, and scanning electron microscopy, are employed for stress and curvature measurements in packaged chips [1][2][3][4][5]. While these methods can detect surface features and warpage deformation of the silicon wafer inside the packaged chips, only X-ray Diffraction (XRD) mapping allows for non-destructive, in situ, and quantitative measurements [6].…”
Section: Introductionmentioning
confidence: 99%