2018
DOI: 10.1016/j.commatsci.2017.09.050
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Investigation and comparison of the large-signal characteristics and dynamical parameters of silicene and germanene nanoribbon interconnects

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Cited by 16 publications
(6 citation statements)
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“…Kinetic/magnetic inductances (L K /L M ), and quantum/electrostatic capacitance (C E /C Q ), as seen in the image, all have a substantial effect on interconnect performance. The C Q and L K appear due to the exchange correlational effects and are unique to the nanoscale devices [13]. Furthermore, the resistance in the two probe setup can be evaluated as follows [7]…”
Section: Dynamical Parameter Ananlysismentioning
confidence: 99%
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“…Kinetic/magnetic inductances (L K /L M ), and quantum/electrostatic capacitance (C E /C Q ), as seen in the image, all have a substantial effect on interconnect performance. The C Q and L K appear due to the exchange correlational effects and are unique to the nanoscale devices [13]. Furthermore, the resistance in the two probe setup can be evaluated as follows [7]…”
Section: Dynamical Parameter Ananlysismentioning
confidence: 99%
“…There are significant issues with using Cu as a metal connection at lower dimensions due to its increased resistivity, grain boundary scattering, and electron migration [8], [9]. Various 2D materials have been reported for use in the design of metal interconnects at the nanoscale [10]- [13]. Theoretical research has shown that GNRs can be used for nanoscale interconnects with chemical edge modification [14] or by doping [15].…”
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confidence: 99%
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“…where V f is the Fermi velocity, e represents the electronic charge, h represents Planck's constant, and N ch is the number of transmission channels across the device [8,35,40]. The calculated number of transmission modes/the number of channels (N ch ) around the Fermi level are presented in table 2.…”
Section: Zgnr Configurationmentioning
confidence: 99%
“…In the semiconductor industry, interconnects are the important interest for Giga scale and Tera scale integrations, due to the challenges of delay, power dissipation, noise and jitter they induce on one another, and their vulnerability to electromigration (EM) [1][2][3][4]. To overcome these challenges, one-dimensional nanomaterials such as carbon nanotubes (CNTs), nanowires, nanoribbons, etc [5][6][7][8][9] have been explored and reported by a number of researchers. Of these, the one-dimensional form of graphene and metallic graphene nanoribbons (GNRs) are good candidates for interconnects.…”
Section: Introductionmentioning
confidence: 99%