Investigating the Effects of Temperature, Paste Height, and Time on Solder Paste to Its Printing Performance

Abstract

Due to pressure to meet consumer requirements, miniaturization, reliability, and increased functionality have become more important. To achieve good assembly of electronic devices, there must be smooth deposition of tiny and consistent paste deposits on the board which must be up to an acceptable height and volume based on desirable process parameters in the output. The printing performance of the solder paste is dependent on conditions such as paste deformation behavior, good paste roll, complete aperture filling, and paste release onto the substrate pads. Eighteen tests were performed using two types of lead-free solder paste. Three temperatures were investigated under three different time intervals. Results analysis showed that variability of the paste distribution was lowest and more uniform for paste stored at 25˚C for 48 hours. From the analysis, it is obvious that temperature has tremendous effects on the printing performance of solder paste. This study recommends 25˚C as a good temperature for solder paste printing.