Investigating the drop impact of portable electronic products

Lim, CT; Low, Yin-Yi

doi:10.1109/ectc.2002.1008269

Cited by 59 publications

(1 citation statement)

References 2 publications

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“…Shock and drop loading is part of MIL-specs and other qualification requirements [5,6]. The rise of portable electronics has in recent years triggered numerous investigations aimed at the prediction and minimizing the adverse consequences of accidental impact loading [7][8][9][10][11][12][13][14][15][16][17][18][19][20][21][22][23][24][25].…”

Section: Introductionmentioning

confidence: 99%

Nonlinear dynamic response of a ‘flexible-and-heavy’ printed circuit board (PCB) to an impact load applied to its support contour

Suhir¹,

Vujosevic²,

Reinikainen³

2009

J. Phys. D: Appl. Phys.

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Based on the developed simple and physically meaningful analytical (‘mathematical’) stress model, we evaluate some major parameters (amplitude, frequency, maximum acceleration, stresses and strains) of the response of a ‘flexible-and-heavy’ square simply supported printed circuit board (PCB) to an impact drop load applied to its support contour. The analysis is restricted to the first mode of vibrations and is carried out in application to the PCB design employed in an advanced accelerated test setup (test vehicle). This setup is aimed at the assessment of the performance, in accelerated test conditions on the board level, of packaging materials (and, first of all, BGA solder joint interconnections) subjected to dynamic (drop or shock) loading. It is anticipated that heavy masses could be mounted on the PCB to accelerate its dynamic response to an impact load. These masses are expected to be small in size, so that while changing the total mass of the board and generating significant inertia forces, they do not affect the board's flexural rigidity or its stiffness with respect to the in-plane loading. The PCB's contour is considered non-deformable, which is indeed the case in many practical situations. This circumstance, if the drop height and/or the induced inertia forces are significant, leads to elevated in-plane (‘membrane’) stresses in the PCB and, as a result of that, to the nonlinear response of the board to the impact load: the relationship between the magnitude of the load (determined by the initial impact velocity) and the induced PCB deflections becomes geometrically nonlinear, with a rigid cubic characteristic of the restoring force. The carried out numerical example, although reflects the characteristics of the PCB and loading conditions in an actual experimental setup, is merely an illustration of the general concept and is intended to demonstrate the abilities of the suggested method. Predictions based on this method agree well with the finite element analysis (FEA) data. The model can be helpful in understanding the physics of the addressed problem. The obtained results can be easily generalized, if necessary, for PCBs of different aspect ratios and with other boundary conditions, for different distributions of the added masses, etc, and applied, with adequate modifications, to PCBs in actual use conditions as well. The model can be used, along with FEA simulations, in the analysis, structural (‘physical’) design and accelerated testing of electronic systems of the type in question, and particularly of 'flexible-and-heavy' PCBs, both in accelerated tests and in actual operation conditions.

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Section: Introductionmentioning

confidence: 99%

Nonlinear dynamic response of a ‘flexible-and-heavy’ printed circuit board (PCB) to an impact load applied to its support contour

Suhir¹,

Vujosevic²,

Reinikainen³

2009

J. Phys. D: Appl. Phys.

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Interconnect Reliability Considerations in Portable Consumer Electronic Products

Canumalla

Viswanadham

Micro- And Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

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On the high strain rate behavior of 63–37 Sn–Pb eutectic solders with temperature effects

Iqbal

Xue

Wang

et al. 2014

International Journal of Impact Engineering

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Abstract:This study presents experimental results performed on samples of Eutectic solder material (63 wt. % Sn 37 wt. % Pb). The tests were performed at high strain rates using Split Hopkinson's Pressure Bar (SHPB). The strain rates were in the range of 400s -1 to 1300s -1 . Heating unit was added to conventional SHPB to vary initial sample temperature conditions. Tests were conducted at room temperature, 60°C and 120°C for the compressive mode, and at room temperature only for the tensile mode. The effects of temperature on the behavior of material were compared. Transient temperature changes during the dynamic loading conditions were calculated by an analytical approach using measured stress-strain data for plastic work. In addition, tests were performed in tension using Tensile Hopkinson's bar (SHTB) under the same initial temperature condition as for the compression tests. Finally, the constitutive relationship based on the JohnsonCook model was developed.

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Investigating the drop impact of portable electronic products

Cited by 59 publications

References 2 publications

Nonlinear dynamic response of a ‘flexible-and-heavy’ printed circuit board (PCB) to an impact load applied to its support contour

Nonlinear dynamic response of a ‘flexible-and-heavy’ printed circuit board (PCB) to an impact load applied to its support contour

Interconnect Reliability Considerations in Portable Consumer Electronic Products

On the high strain rate behavior of 63–37 Sn–Pb eutectic solders with temperature effects

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